Lga1155 Socket; Lga1155 Socket With Pick And Place Cover - Intel 2ND GENERATION CORE PROCESSOR FAMILY DESKTOP - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications
Thermal mechanical specifications and design guidelines (tmsdg) for 2nd generation intel core processor family desktop and lga1155 socket
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LGA1155 Socket
3
LGA1155 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the
processors. The socket provides I/O, power and ground contacts. The socket contains
1155 contacts arrayed about a cavity in the center of the socket with lead-free solder
balls for surface mounting on the motherboard.
The contacts are arranged in two opposing L-shaped patterns within the grid array. The
grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and
selective depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The ILM design includes a back plate which is integral to
having a uniform load on the socket solder joints. Socket loading specifications are
listed in
Chapter
Figure 3-1.
LGA1155 Socket with Pick and Place Cover
Thermal/Mechanical Specifications and Design Guidelines
5.
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