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3.1.4
Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.1.5
Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.1.6
Processor Materials
Table 23
Table 23.
Processor Materials
Integrated Heat Spreader (IHS)
3.1.7
Processor Markings
Figure 12
are to aid in the identification of the processor.
Figure 12.
Processor Top-Side Markings Example for the Intel
Processor E6000 Sequence with 4 MB L2 Cache with 1333 MHz FSB
42
lists some of the package components and associated materials.
Component
Substrate
Substrate Lands
through
Figure
16show the topside markings on the processor. The diagrams
INTEL
INTEL® CORE™2 DUO
SLxxx [COO]
3.00GHZ/4M/1333/06
[FPO]
Package Mechanical Specifications
Material
Nickel Plated Copper
Fiber Reinforced Resin
Gold Plated Copper
®
Core™2 Duo Desktop
©'05 E6850
M
e
4
ATPO
S/N
Datasheet
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