HP 8560E Service Manual page 229

Replaceable Parts
Firmware-Dependent Part Numbers
Table 4-2 Abbreviations
A
ADJ
ANSI
ASSY
AWG
BCD
BD
BE-CU
BNC
BRG
BRS
BSC
BTN
228
ABBREVIATIONS
A
Across Flats, C
Acrylic,
Air (Dry
Method),
Ampere
Adjust,
Adjustment
American
National
Standards CCP
Institute
(formerly
USASI-ASA) CD
Assembly
American CER
Wire Gage
CHAM
B CHAR
Binary Coded
Decimal
Board, CMOS
Bundle
Beryllium
Copper
Type of
Connector
Bearing, CNDCT Conducting,
Boring
Brass
Basic
Button
C CONT
Capacitance,
Capacitor,
Center Tapped, CONV
Cermet, Cold, CPRSN Compression
Compression CUP-PT Cup Point
Carbon CW
Composition
Plastic
Cadmium,
Card,
Cord
Ceramic D
Chamfer
Character,
Characteristic, DA
Charcoal DAP-GL Diallyl
Complementary
Metal Oxide DBL
Semiconductor DCDR
DEG
Conductive, D-HOL
E
Conductivity, DIA
Conductor DIP
Contact,
Continuous,
Control,
Controller
Converter
Clockwise,
Continuous
Wave
D
Deep,
Depletion,
Depth,
Diameter,
Direct
Current
Darlington
Phthalate
Glass
Double
Decoder
Degree
D-Shaped
Hole
Diameter
Dual In-Line
Package
Chapter 4