Bill Of Material Structure - Siemens Vendor Manual

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MicroHarmony Cell Sizes 40 - 260A Manual

2.9 Bill of Material Structure

The BOM is structured to take advantage of the common design 40-140A cells, and 200-260A cells. The top level
bill consists of:
1.
Capacitors
2.
Capacitor trays
3.
Common parts (used on all cells regardless of current rating: input rectifier modules, heat sink, wire
harnesses, power plugs, thermodisc, and handles)
4.
Hardware kit (screws, washers, thermal compound, bushings, etc.)
5.
IGBT kits
6.
Reference drawings
10000424.140
Capacitor Vendor #1
Capacitor Vendor #2
Capacitor Vendor #3
Capacitor Mounting Tray
Common Parts Kit
IGBT Kit Fuji 200A
IGBT Kit Mitsubishi 200A
IGBT Kit Eupec 200A
Schematic
Outline
Assembly
Manual
19001467: Version 1.0
12
0
0
2
1
Chassis/Bus Kit
1
Glastic Kit
1
Hardware Kit
1
Misc Parts
0
0
1
Dual IGBT Module, 200A 1700V
Gate Clamp Board w/ resistor
Cell Control Board
Label, IGBT Install
Figure 2-5: Bill of Material Structure
s
Physical Description
2
2
2
2
2
2-11

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