Assembly Notes; Heat Sink Thermal Compound - Siemens Vendor Manual

MicroHarmony Cell Sizes 40 - 260A Manual Physical Description

2.10 Assembly Notes

2.10.1 Heat Sink Thermal Compound

For proper thermal performance, the specified thermal compound and application procedure must be followed.
2
Failure to do so may result in excessive heating and catastrophic cell damage.
The assembly drawing identifies the approved compound and application procedure, which is shown below for the
40-140A cells. Thickness to be 0.004" thick using tape as a mask.
Figure 2-6: Assembly Drawing
s
19001467: Version 1.0 2-13