Atx Form Factor; Form Factor; Thermal Characterization Parameters For Various Operating Conditions; Enabled Thermal Solutions - Intel Celeron D Thermal Design Manual

Figure 8. Thermal Characterization Parameters for Various Operating Conditions
5.2

ATX Form Factor

Intel is enabling the following active thermal solutions for the Celeron D Processor in the 775-land
LGA package for Embedded Applications in the ATX, similar, or larger form factors.
Table 5.

Enabled Thermal Solutions

Heatsink Manufacturer
Sanyo-Denki*
These solutions have been tested in environments with a T
thermal solution verification should be performed in the final intended use.
5.3 1U Form Factor
Thermal solution design for the 1U form factor is challenging. Due to limited volume for the
heatsink, mainly in the direction of heatsink height, and the available amount of airflow, system
designers may have to make trade-offs in the system boundary condition requirements (i.e.,
® ®
Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide31
303730
Order #
Intel Part Number
Nidec*
Intel Enabled Thermal Solutions
C25697-001
C25704-002
up to 38° C. However, system-level
LA