Intel Celeron D Thermal Design Manual page 61

775-land lga package for embedded applications
Table of Contents

Advertisement

Mechanical Drawings
Figure 36. ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions
for Enabling Components, Sheet 3
®
®
Intel
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide61
303730
Order #

Advertisement

Table of Contents
loading

Table of Contents