Intel Celeron D Thermal Design Manual page 50

Case Temperature Reference Methodology
The orientation of the groove relative to the package pin 1 indicator (gold triangle in one corner of
the package) is shown.
Figure 20. IHS Reference Groove on the FC-LGA4 Package
Pin Indicator
When the processor is installed in the LGA775 socket, the groove is perpendicular to the socket
load lever, and on the opposite side of the lever, as shown
Figure 21. IHS Groove Orientation Relative to the LGA775 Socket
Select a machine shop that is capable of holding drawing specified tolerances. IHS channel
geometry is critical for repeatable placement of the thermocouple bead, ensuring precise thermal
measurements. The specified dimensions minimize the impact of the groove on the IHS under the
socket load. A larger groove may cause the IHS to warp under the socket load such that it does not
represent the performance of an ungrooved IHS on production packages.
Inspect parts for compliance to specifications before accepting from machine shop.
Intel
50
Figure 20 for the FC-LGA4 package IHS.
® ®
Celeron D Processor in the 775-Land LGA Package Thermal Design Guide
IHS Groove
Figure 21.
Order #303730