Contents
4.2.7.1
4.2.7.2
4.2.8
THERMTRIP# Signal............................................................................................. 28
4.2.8.1
4.2.9
4.2.9.1
4.2.9.2
4.3
5.0
5.1
5.2
ATX Form Factor ................................................................................................................ 31
5.3
1U Form Factor................................................................................................................... 31
5.4
2U Form Factor................................................................................................................... 33
5.5
6.0
Conclusion ................................................................................................................................... 36
A
B
C
D
E
F
Mechanical Drawings .................................................................................................................. 58
G
Vendor Information ..................................................................................................................... 64
Figures
1
Package IHS Load Areas ............................................................................................................. 9
2
3
Example Thermal Profile ............................................................................................................ 13
4
5
- Active Heatsink............................................................................................... 21
6
- Passive Heatsink ............................................................................................ 22
7
8
9
1U Copper Heatsink ................................................................................................................... 32
11 2U Copper Heatsink ................................................................................................................... 33
13 2U Height Restrictions................................................................................................................ 35
Intel
4
®
®
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide
(°C/W).......................................... 34
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