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Figure 2-9
Figure 2-9.
T
CONTROL
If the DTS temperature is less than T
to exceed the Thermal Profile, but the DTS temperature must remain at or below
T
CONTROL
T
at or below the Thermal Profile when operating between the T
CASE
T
CASE_MAX
Refer to
Section 2.4.1
speed control (FSC) design to achieve better acoustic performance.
2.2.7
Thermal Profile Concepts for the Quad-Core Intel® Xeon®
Processor 5400 Series
2.2.7.1
Dual Thermal Profile Concept for the
X5400 Series
The Quad-Core Intel® Xeon® Processor X5400 Series is designed to go into various
form factors, including the volumetrically constrained 1U and custom blade form
factors. Due to certain limitations of such form factors (i.e. airflow, thermal solution
height), it is very challenging to meet the thermal requirements of the processor. To
mitigate these form factor constraints, Intel has developed a dual Thermal Profile
specification, shown in
26
depicts the interaction between the Thermal Profile and T
and Thermal Profile Interaction
. The thermal solution for the processor must be able to keep the processor's
at TDP under heavy workload conditions.
for the implementation of the T
Figure
2-10.
Thermal/Mechanical Reference Design
, then the case temperature is permitted
CONTROL
CONTROL
Quad-Core Intel® Xeon® Processor
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
.
CONTROL
and
CONTROL
value in support of fan
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