Page 1 HPE Apollo 2000 System Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Page 2 © 2014, 2017 Hewlett Packard Enterprise Development LP The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.
Page 3: Table Of Contents
Contents HPE Apollo 2000 System................7 Introduction............................7 Customer self repair..................8 Illustrated parts catalog................18 System components.......................... 18 Chassis system components....................18 Node system components...................... 22 Removal and replacement procedures............29 Required tools........................... 29 Safety considerations........................29 Preventing electrostatic discharge..................29 Symbols on equipment......................29 Server warnings and cautions....................
Page 4 DIMMs..............................111 Memory and processor information..................111 Removing the DIMMs......................113 System battery..........................114 System board...........................115 Re-entering the server serial number and product ID............120 HP Trusted Platform Module......................120 Troubleshooting..................121 Troubleshooting resources......................121 Diagnostic tools..................122 UEFI System Utilities........................122 Using UEFI System Utilities....................122 Flexible boot control......................122 Restoring and customizing configuration settings..............
Page 5 USB support............................ 126 External USB functionality....................127 Internal USB functionality..................... 127 Component identification............... 128 Chassis front panel components..................... 128 Chassis front panel LEDs and buttons.................... 129 Chassis rear panel components...................... 131 Chassis rear panel LEDs.........................132 Node rear panel components......................132 Node rear panel LEDs and buttons....................
Page 6 Websites....................174 Documentation feedback................ 175 Acronyms and abbreviations..............176 Acronyms and abbreviations......................176 Contents...
Page 7: Hpe Apollo 2000 System
HPE Apollo 2000 System Introduction The HPE Apollo 2000 System consists of a chassis and nodes. There are three chassis options with different storage configurations. To ensure proper thermal cooling, the four server tray slots on the chassis must be populated with server nodes or node blanks.
Page 8: Customer Self Repair
Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
Page 9 REMARQUE: Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, Hewlett Packard Enterprise exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non"...
Page 10 Per ulteriori informazioni sul programma CSR di Hewlett Packard Enterprise, contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web. Servizio di garanzia per i soli componenti La garanzia limitata Hewlett Packard Enterprise può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia del servizio per i soli componenti, Hewlett Packard Enterprise fornirà...
Page 11 Reparaciones del propio cliente Los productos de Hewlett Packard Enterprise incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, Hewlett Packard Enterprise (o los proveedores o socios de servicio de Hewlett Packard Enterprise) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, Hewlett Packard Enterprise le enviará...
Page 12 • Verplicht—Onderdelen waarvoor reparatie door de klant verplicht is. Als u Hewlett Packard Enterprise verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht. • Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant.
Page 13 Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da Hewlett Packard Enterprise para que um técnico o ajude por telefone.
Page 14 Customer self repair...
Page 15 Customer self repair...
Page 16 Customer self repair...
Page 17 Customer self repair...
Page 18: Illustrated Parts Catalog
Illustrated parts catalog System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website. Chassis system components Item Description Spare part Customer self number repair 12 low-profile LFF drive cage —...
Page 19 Item Description Spare part Customer self number repair c) HPE 800W Flex Slot Universal Hot Plug Power Supply Kit – 754379-001 Mandatory 94% efficiency* d) HPE 800W Flex Slot Titanium Hot Plug Power Supply Kit – 754378-001 Mandatory 96% efficiency* e) HPE 800W Flex Slot -48VDC Hot Plug Power Supply Kit –...
Page 20 No—Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog. Obligatoire—Pièces pour lesquelles le client doit procéder lui-même aux réparations.
Page 21 Optioneel—Onderdelen die de klant zelf kan vervangen. Deze onderdelen zijn ook ontworpen om door de klant zelf te worden vervangen. Als u Hewlett Packard Enterprise verzoekt om deze te vervangen, kan het zijn dat hiervoor extra kosten in rekening worden gebracht, afhankelijk van het soort garantie dat op uw product van toepassing is.
Page 22: Node System Components
Node system components Item Description Spare part Customer self- number repair Air baffle kit (includes 1U baffle and 2U baffle)* 811223-001 Mandatory 1U air baffle — — 2U air baffle — — Dedicated iLO management port 800369-001 Optional System board assemblies (include alcohol pad and thermal —...
Page 23 Item Description Spare part Customer self- number repair h) 2.3-GHz Intel Xeon E5-2650 v3, 10C, 105W* 762448-001 Optional i) 2.3-GHz Intel Xeon E5-2699 v3, 18C, 145W* 780761-001 Optional j) 2.3-GHz Intel Xeon E5-2695 v3, 14C, 120W* 762454-001 Optional k) 2.4-GHz Intel Xeon E5-2630 v3, 8C, 85W* 762446-001 Optional l) 2.4-GHz Intel Xeon E5-2620 v3, 6C, 85W*...
Page 24 Item Description Spare part Customer self- number repair q) 2.6-GHz Intel Xeon E5-2690 v4, 14C, 135W* 835607-001 Optional r) 2.6-GHz Intel Xeon E5-2697A v4, 16C, 145W* 841035-001 Optional s) 3.2-GHz Intel Xeon E5-2667 v4, 8C, 135W* 835613-001 Optional t) 3.4-GHz Intel Xeon E5-2643 v4, 6C, 135W* 835612-001 Optional DIMM...
Page 25 Item Description Spare part Customer self- number repair M.2 SATA SSD enablement board* 800371-001 Optional PCIe transfer board* 800372-001 Optional Three-slot PCIe x16 11OS 2U node riser board* 800373-001 Optional Three-slot GPU-direct PCIe x16 2U node riser board* 800374-001 Optional Three-slot GPU-direct with re-timer PCIe x16 2U node riser 828927-001 Optional...
Page 26 Item Description Spare part Customer self- number repair c) 2-pin accelerator adapter cable (for NVIDIA GRID K2 RAF — — GPUs only)* Accelerator 1 power cable for a three-slot riser cage assembly 867336-001 Mandatory (this cable supports NVIDIA Tesla K40 GPUs, NVIDIA GRID K2 RAF GPUs, AMD FirePro S9150 GPUs, AMD FirePro S7150 GPUs, and Intel Xeon Phi 5110P Coprocessors)* Accelerator 2 power cable for a three-slot riser cage assembly...
Page 27 Obligatoire—Pièces pour lesquelles le client doit procéder lui-même aux réparations. Si vous demandez à Hewlett Packard Enterprise de procéder au remplacement de ces pièces, les frais de transport et de main d’œuvre pour ce service vous seront facturés. Facultatif—Pièces pour lesquelles une réparation par le client est facultative. Ces pièces sont également conçues pour que le client puisse procéder lui-même aux réparations.
Page 28 Geen—Sommige onderdelen van Hewlett Packard Enterprise zijn niet ontworpen om door de klant zelf te worden vervangen. Om te voldoen aan de garantievoorwaarden eist Hewlett Packard Enterprise dat een geautoriseerde serviceverlener het onderdeel vervangt. Deze onderdelen worden aangeduid met 'Geen' in de geïllustreerde onderdelencatalogus.
Page 29: Removal And Replacement Procedures
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15/T-20 Torx screwdriver • Flathead screwdriver (for replacing the system battery) • HPE Insight Diagnostics • Thin-nose pliers (for replacing the chassis power distribution board) Safety considerations Before performing service procedures, review all the safety information.
Page 30: Server Warnings And Cautions
This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching. This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.
Page 31: Rack Warnings
CAUTION: To ensure proper thermal cooling, the four server tray slots must be populated with server nodes or node blanks. Rack warnings WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • The leveling jacks are extended to the floor. •...
Page 32: Power Down The System
• Remove the bayonet board assembly. • Remove the PCI riser cage assembly. • Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly. • Remove Accelerator 1 from the three-slot riser cage assembly. • Remove Accelerator 2 from the three-slot riser cage assembly. Power down the system IMPORTANT: When the nodes are in standby mode, auxiliary power is still being provided to the system.
Page 33 CAUTION: To avoid damage to the node , always support the bottom of the node when removing it from the chassis . CAUTION: To ensure proper thermal cooling, the four server tray slots must be populated with server nodes or node blanks.
Page 34: Remove The Node Blank From The Chassis
CAUTION: To avoid damage to the device, do not use the removal handle to carry it. 4. Place the node on a flat, level surface. Remove the node blank from the chassis About this task CAUTION: To ensure proper thermal cooling, the four server tray slots must be populated with server nodes or node blanks.
Page 35: Remove The Power Supply
Remove the power supply CAUTION: Do not mix power supplies with different efficiency and wattage in the chassis. Install only one type of power supply. Verify that all power supplies have the same part number and label color. The system becomes unstable and may shut down when it detects mismatched power supplies.
Page 36: Remove The Chassis From The Rack
Remove the chassis from the rack About this task WARNING: The chassis is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling.
Page 37: Remove The Security Bezel
If installed, remove the security bezel. Remove all drives. If installed, remove the RCM module. Remove all power supplies. Loosen the thumbscrews and extend the chassis from the rack. Remove the chassis from the rack. For more information, see the documentation that ships with the rack mounting option. 10.
Page 38: Remove The Pdb Cover
Remove the PDB cover Power down the system. Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis. If installed, remove the security bezel. Remove all drives. If installed, remove the RCM module. Remove all power supplies. Remove the chassis from the rack.
Page 39: Remove The Chassis Access Panel
Remove the chassis access panel Procedure Power down all nodes. Disconnect all peripheral cables from the nodes and chassis. WARNING: The chassis is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling.
Page 40: Remove The Chassis Pdb Assembly
If installed, remove the security bezel. Remove all drives. If installed, remove the RCM module. Remove all power supplies. Remove the chassis from the rack. Remove the access panel. 10. Remove all fan modules. 11. Disconnect the fan power cable assemblies from the fan cages. 12.
Page 41 Remove all nodes from the chassis. If installed, remove the security bezel. Remove all drives. If installed, remove the RCM module. Remove all power supplies. Remove the chassis from the rack. Remove the access panel. 10. If Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the Smart Storage Battery cable.
Page 42: Remove The Rear I/O Blank
d. Disconnect the RCM 2.0 cable from the power distribution board and remove the chassis PDB assembly. Remove the rear I/O blank Procedure 1. Power down the node . 2. Disconnect all peripheral cables from the node . 3. Remove the node from the chassis. 4.
Page 43 • 1U right rear I/O blank • 2U rear I/O blank Removal and replacement procedures...
Page 44: Remove The Air Baffle
CAUTION: To prevent improper cooling and thermal damage, do not operate the node unless all PCI riser cages or rear I/O blanks are installed, and do not operate the node unless all PCI slots have either an expansion slot cover or an expansion board installed. Remove the air baffle Procedure 1.
Page 45: Remove The Bayonet Board Assembly
• 2U air baffle Remove the bayonet board assembly Power down the node . Disconnect all peripheral cables from the node . Remove the node from the chassis. Place the node on a flat, level surface. If installed in a 2U node, remove the FlexibleLOM 2U node riser cage assembly. If installed in a 2U node, remove the three-slot PCI riser cage assembly.
Page 46 • 2U bayonet board assembly 10. If installing a SATA or Mini-SAS cable, remove the bayonet board bracket from the bayonet board. • 1U bayonet board bracket • 2U bayonet board bracket Removal and replacement procedures...
Page 47: Remove The Pci Riser Cage Assembly
Remove the PCI riser cage assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to the server or expansion boards, power down the server, and disconnect all power cords before removing or installing the PCI riser cage.
Page 48: Single-Slot 1U Node Right Pci Riser Cage Assemblies
• 2U node CAUTION: To prevent improper cooling and thermal damage, do not operate the node unless all PCI riser cages or rear I/O blanks are installed, and do not operate the node unless all PCI slots have either an expansion slot cover or an expansion board installed.
Page 49: Flexiblelom 1U Node Riser Cage Assembly
Procedure 1. Power down the node. 2. Disconnect all peripheral cables from the node. 3. Remove the node from the chassis. 4. Do one of the following: • Remove the 1U left rear I/O blank. • Remove the single-slot left PCI riser cage assembly. 5.
Page 50: Single-Slot 2U Node Pci Riser Cage Assembly
CAUTION: To prevent improper cooling and thermal damage, do not operate the node unless all PCI riser cages or rear I/O blanks are installed, and do not operate the node unless all PCI slots have either an expansion slot cover or an expansion board installed. Single-slot 2U node PCI riser cage assembly Procedure 1.
Page 51: Flexiblelom 2U Node Riser Cage Assembly
CAUTION: To prevent improper cooling and thermal damage, do not operate the node unless all PCI riser cages or rear I/O blanks are installed, and do not operate the node unless all PCI slots have either an expansion slot cover or an expansion board installed. FlexibleLOM 2U node riser cage assembly Procedure 1.
Page 52: Remove The Riser Cage Bracket From The Three-Slot Riser Cage Assembly
CAUTION: To prevent improper cooling and thermal damage, do not operate the node unless all PCI riser cages or rear I/O blanks are installed, and do not operate the node unless all PCI slots have either an expansion slot cover or an expansion board installed. Remove the riser cage bracket from the three-slot riser cage assembly About this task To remove the component:...
Page 53: Remove Accelerator 1 From The Flexiblelom 2U Node Riser Cage Assembly
Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly About this task To remove the component: Procedure 1. Power down the node . 2. Disconnect all peripheral cables from the node . 3. Remove the node from the chassis . 4.
Page 54 • Intel Xeon Phi Coprocessor 5110P • AMD FirePro S9150 GPU Removal and replacement procedures...
Page 55: Remove Accelerator 1 From The Three-Slot Riser Cage Assembly
• NVIDIA Quadro K4200 GPU or NVIDIA Quadro M4000 GPU Remove Accelerator 1 from the three-slot riser cage assembly About this task To remove the component: Procedure Power down the node . Disconnect all peripheral cables from the node . Remove the node from the chassis .
Page 56 • NVIDIA K40, K80, M60, M40, P40, or P100 GPU • NVIDIA GRID K2 GPU • Intel Xeon Phi Coprocessor 5110P Removal and replacement procedures...
Page 57 • AMD FirePro S9150 GPU • AMD FirePro S7150 GPU Removal and replacement procedures...
Page 58: Remove Accelerator 2 From The Three-Slot Riser Cage Assembly
Remove Accelerator 2 from the three-slot riser cage assembly About this task To remove the component: Procedure 1. Power down the node . 2. Disconnect all peripheral cables from the node . 3. Remove the node from the chassis . 4.
Page 59 • NVIDIA GRID K2 GPU • Intel Xeon Phi Coprocessor 5110P Removal and replacement procedures...
Page 60 • AMD FirePro S9150 GPU • AMD FirePro S7150 GPU Removal and replacement procedures...
Page 61: Chassis Assembly
Chassis assembly About this task CAUTION: If replacing the HPE Apollo r2800 Chassis, verify the original drive bay mapping configuration to prevent possible data loss. For more information, see "Drive bay mapping for the HPE Apollo r2800 Chassis." To remove the component: Procedure 1.
Page 62 c. Install all fan modules and connect the fan cables to the power connectors. Install the access panel. WARNING: Always use at least two people to lift the chassis into the rack. If the chassis is being loaded into the rack above chest level, a third person must assist with aligning the chassis with the rails while the other two people support the weight of the chassis .
Page 63: Power Distribution Board (Pdb)
Power distribution board (PDB) CAUTION: If replacing the power distribution board in the Apollo r2800 Chassis, verify the original drive bay mapping configuration to prevent possible data loss. For more information, see "Drive bay mapping for the HPE Apollo r2800 Chassis." To remove the component: Power down the system.
Page 64: Drive Bay Mapping For The Hpe Apollo R2800 Chassis
16. Using a T-15 Torx screwdriver, remove the RPS link board assembly. To replace the component, reverse the removal procedure. Drive bay mapping for the HPE Apollo r2800 Chassis The HPE Apollo r2800 Chassis, featuring the storage expander backplane, supports the flexibility to assign drive bays to specific server nodes.
Page 65: Factory Default Configuration
• Apollo 2000 System Chassis firmware version 1.4.0 or later • Storage Expander firmware version 1.0 or later • iLO firmware version 2.10 or later Factory default configuration The factory default configuration evenly distributes the 24 SFF drive bays in the HPE Apollo r2800 Chassis.
Page 66: Pdb Pass-Through Board
PDB pass-through board To remove the component: Power down the system. Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis. If installed, remove the security bezel. Remove all drives. If installed, remove the RCM module. Remove all power supplies.
Page 67: Rps Link Board
16. Using a T-15 Torx screwdriver, remove the support bracket from the PDB pass-through board. To replace the component, reverse the removal procedure. RPS link board Power down the system. Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis. If installed, remove the security bezel.
Page 68 11. Remove the PDB cover. 12. Disconnect all cables from the PDB. 13. Disconnect the PDB pass-through cable from the pass-through board. 14. Remove the chassis PDB assembly. 15. Using a T-15 Torx screwdriver, remove the RPS link board assembly. 16.
Page 69: Rcm 2.0 Cable
To replace the component, reverse the removal procedure. RCM 2.0 cable To remove the component: Power down the system. Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis. If installed, remove the security bezel. Remove all drives.
Page 70: Drive Backplane
12. Disconnect all cables from the PDB. 13. Disconnect the PDB pass-through cable from the pass-through board. 14. Remove the chassis PDB assembly. 15. Remove the two screws from the bottom of the chassis. 16. Remove the RCM 2.0 cable. To replace the component, reverse the removal procedure.
Page 71 11. Remove the PDB cover. 12. Disconnect all cables from the PDB. 13. Disconnect the PDB pass-through cable from the pass-through board. 14. Remove the chassis PDB assembly. 15. Remove all fan modules. 16. Remove the fan cages. 17. If replacing the storage expander backplane in the Apollo r2800 Chassis, remove the storage expander card.
Page 72: Storage Expander Card (Hpe Apollo R2800 Chassis Only)
• Storage expander backplane (24 SFF drive backplane for Apollo r2800 Chassis) To replace the component, reverse the removal procedure. Storage expander card (HPE Apollo r2800 Chassis only) To remove the component: Power down the system. Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis.
Page 73: Fan Module
11. Remove the PDB cover. 12. Disconnect all cables from the PDB. 13. Disconnect the PDB pass-through cable from the pass-through board. 14. Remove the chassis PDB assembly. 15. Remove all fan modules. 16. Remove the fan cages. 17. Disconnect all cables from the storage expander card. 18.
Page 74 Procedure Power down the system. Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis. If installed, remove the security bezel. Remove all drives. If installed, remove the RCM module. Remove all power supplies. Remove the chassis from the rack. Remove the access panel.
Page 75: Hpe Smart Storage Battery
HPE Smart Storage Battery WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Page 76: Rcm Module
To replace the component, reverse the removal procedure. RCM module Observe the following rules and limitations when installing an RCM module: • If a dedicated iLO management port module is installed in a node, the node cannot be accessed through the RCM module.
Page 77: Rcm 2.0 To 1.0 Adapter Cable
RCM 2.0 to 1.0 adapter cable To remove the component: 1. Power down the system. 2. Disconnect the RCM 2.0 to 1.0 adapter cable from APM. 3. Disconnect the RCM 2.0 to 1.0 adapter cable from the RCM module. To replace the component, reverse the removal procedure. Hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are...
Page 78: Bezel Ear
1. Back up all node data on the drive. 2. Determine the status of the drive from the hot-plug drive LED definitions. 3. Remove the hot-plug drive. • SFF HPE SmartDrive • Low-profile LFF hot-plug drive To replace the component, reverse the removal procedure. Bezel ear To remove the component: Power down the system.
Page 79 • Left front I/O cable cover 13. Disconnect the front I/O cable from the drive backplane. 14. Remove the bezel ear. • Right bezel ear Removal and replacement procedures...
Page 80: Fbwc Module
• Left bezel ear 15. Disconnect the front I/O cable from the bezel ear. To replace the component, reverse the removal procedure. FBWC module About this task WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Page 81 CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: Procedure 1. Power down the node . 2. Disconnect all peripheral cables from the node . 3.
Page 82: Dedicated Ilo Management Port Module
Dedicated iLO management port module Observe the following rules and limitations when installing an dedicated iLO management port module: • If a dedicated iLO management port module is installed in a node, the node can only connect to a network through the dedicated iLO management port module.
Page 83: Riser Boards
A message prompt to confirm the iLO settings reset appears. 6. Press Enter to reboot the iLO settings. 7. Press Esc until the main menu is displayed. 8. Select Reboot the System to exit the utility and resume the boot process. The IP address of the enabled dedicated iLO connector appears on the POST screen on the subsequent boot-up.
Page 84 • PCIe x16 right 1U node riser board • FlexibleLOM x8 1U node riser board Removal and replacement procedures...
Page 85 • FlexibleLOM x16x8 2U node riser board • Three-slot PCIe x16 11OS 2U node riser board Removal and replacement procedures...
Page 86 • Three-slot PCIe x16 GPU-direct 2U node riser board • Three-slot GPU-direct with re-timer PCIe x16 2U node riser board Removal and replacement procedures...
Page 87: Pcie Transfer Board
To replace the component, reverse the removal procedure. PCIe transfer board About this task To remove the component: Procedure 1. Power down the node . 2. Disconnect all peripheral cables from the node . 3. Remove the node from the chassis . 4.
Page 88: M.2 Sata Ssd Enablement Board
To replace the component, reverse the removal procedure. M.2 SATA SSD enablement board To remove the component: 1. Power down the node . 2. Disconnect all peripheral cables from the node . 3. Remove the node from the chassis . 4.
Page 89 • Single-slot 2U node PCI riser cage assembly 9. Loosen the T-10 screw and remove the M.2 SATA SSD cards from the failed enablement board. • Remove the first M.2 SATA SSD card Removal and replacement procedures...
Page 90: Heatsink
• Remove the second M.2 SATA SSD card To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this node .
Page 91 CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed. IMPORTANT: Processor socket 1 must be populated at all times or the node does not function. 1.
Page 92 CAUTION: Heatsink retaining screws should be tightened in diagonally opposite pairs (in an "X" pattern). 3. Install the heatsink: a. Position the heatsink on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. c.
Page 93: Processor
Processor About this task WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this node .
Page 94 CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. 9. Remove the processor from the processor retaining bracket. To replace the component: Install the processor.
Page 95 CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. CAUTION: Do not press down on the processor. Pressing down on the processor might damage the processor socket and the system board.
Page 96 Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. Install the heatsink: a.
Page 97: Accelerators
Install the air baffle. Install any removed PCI riser cage assemblies. 10. Install the node into the chassis. 11. Connect all peripheral cables to the node . 12. Power up the node . Accelerators Accelerator population rules Observe the following population rules when installing an accelerator in the node: •...
Page 98: Supported Riser Cage Assemblies And Accelerator Power Cables
◦ If NVIDIA Tesla P100 GPUs are installed in the server node, and the server node is installed in the HPE Apollo r2600 Chassis, the inlet ambient temperature must be maintained at or below 20°C (68°F). ◦ To ensure proper thermal cooling when NVIDIA Tesla P40 or NVIDIA Tesla P100 GPUs are installed in the server node, bezel blanks must be installed in specific drive bays.
Page 99: Replacing Accelerator 1 In The Flexiblelom 2U Node Riser Cage Assembly
Three-slot GPU-direct PCI riser cage assembly (PN 798188-B21) Dual accelerator options Power cable 2-pin adapter cables Both 825634-001 and 825635-001 Not supported • Intel Xeon Phi Coprocessor are required 5110P • AMD FirePro S9150 GPU • NVIDIA Tesla K40 GPU Accelerator Both 825634-001 and 825635-001 805206-001 required for each...
Page 100: Replacing Accelerator 1 In A Three-Slot Riser Cage Assembly
Procedure 1. Power down the node . 2. Disconnect all peripheral cables from the node . 3. Remove the node from the chassis . 4. Place the node on a flat, level surface. 5. Remove the FlexibleLOM 2U node riser cage assembly. 6.
Page 101 2. Remove the rear support bracket for Accelerator 1. IMPORTANT: Keep this bracket to install it onto the new accelerator. • NVIDIA Tesla K40, K80, M60, M40, P40, or P100 GPU • NVIDIA GRID K2 GPU Removal and replacement procedures...
Page 102 • Intel Xeon Phi Coprocessor 5110P • AMD FirePro S9150 GPU Removal and replacement procedures...
Page 103: Replacing Accelerator 2 In A Three-Slot Riser Cage Assembly
• AMD FirePro S7150 GPU 3. Remove the existing rear support bracket from the new accelerator. Keep this bracket to install it onto the failed accelerator. 4. Install the rear support bracket for Accelerator 1 onto the new accelerator. 5. If replacing a NVIDIA Tesla K40 GPU, install the front support bracket for Accelerator 1 onto the new K40 GPU.
Page 104 5. Remove the three-slot riser cage assembly. 6. Disconnect the accelerator power cable from the bayonet board. 7. Remove the riser cage bracket from the three-slot riser cage assembly. 8. Disconnect all cables from the accelerators. 9. Remove Accelerator 2 from the three-slot riser cage assembly. To replace the component: 1.
Page 105 • AMD FirePro S9150 GPU a. Remove the rear support bracket. b. Remove the cover from Accelerator 2. c. Remove the front support bracket. Removal and replacement procedures...
Page 106 • AMD FirePro S7150 GPU a. Remove the rear support bracket. b. Remove the cover from Accelerator 2. c. Remove the front support bracket. Removal and replacement procedures...
Page 107 2. Remove the existing rear support bracket from the new accelerator. Keep this bracket to install it onto the failed accelerator. 3. If replacing an AMD FirePro S9150 GPU or AMD FirePro S7150 GPU, remove the cover from the new accelerator: •...
Page 108: Expansion Board
4. Remove the existing front support bracket from the accelerator. Keep this bracket to install it onto the failed accelerator. • AMD FirePro S9150 GPU or AMD FirePro S7150 GPU 5. Install the front and rear support brackets for Accelerator 2 onto the new accelerator: a.
Page 109 Procedure 1. Power down the node . 2. Disconnect all peripheral cables from the node . 3. Remove the node from the chassis . 4. Remove the PCI riser cage assembly. 5. Disconnect any internal cables that are connected to the expansion board. 6.
Page 110 • Slot 2 of the FlexibleLOM 2U riser cage assembly • Slot 2 of a three-slot riser cage assembly Removal and replacement procedures...
Page 111: Dimms
7. If you are removing a storage controller board with a cache module installed, remove the cache module. To replace the component, reverse the removal procedure. DIMMs Memory and processor information For the latest memory configuration information, see the product QuickSpecs on the Hewlett Packard Enterprise website.
Page 112 DIMM specifications - Intel Xeon E5-2600 v4 processor installed Type Rank Capacity (GB) Native speed Voltage (MT/s) RDIMM Single 2400 RDIMM Single 2400 RDIMM Dual 2400 RDIMM Dual 2400 LRDIMM Dual 2400 LRDIMM Quad 2400 LRDIMM Octal 2400 Populated DIMM speed (MT/s) Operating memory speed is a function of rated DIMM speed, the number of DIMMs installed per channel, processor model, and the speed selected in the BIOS/Platform Configuration (RBSU) of the UEFI System Utilities.
Page 113: Removing The Dimms
DIMM type DIMM rank Capacity (GB) Maximum capacity Maximum capacity for one processor for two processors (GB) (GB) RDIMM Single-rank RDIMM Single-rank RDIMM Dual-rank RDIMM Dual-rank LRDIMM Dual-rank RDIMM Dual-rank LRDIMM Quad-rank Maximum memory capacity - Intel Xeon E5-2600 v4 processor installed DIMM type DIMM rank Capacity (GB)
Page 114: System Battery
• Remove the three-slot PCI riser cage assembly. • Remove the FlexibleLOM 2U node PCI riser cage assembly. 6. Remove the air baffle. 7. Open the DIMM slot latches. 8. Remove the DIMM. To replace the component, reverse the removal procedure. System battery If the node no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock.
Page 115: System Board
IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
Page 116 Remove all DIMMs. 10. Remove the heatsink: a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b. Completely loosen all screws in the same sequence. c. Remove the heatsink from the processor backplate. 11.
Page 117 13. If installed, remove the dedicated iLO module. 14. Disconnect all cables connected to the system board. 15. Remove the failed system board. To replace the system board: Install the system board. Removal and replacement procedures...
Page 118 Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
Page 119 Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Install the heatsink: a. Position the heatsink on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. c.
Page 120: Re-Entering The Server Serial Number And Product Id
Press the Esc key to close the menu. 10. Press the Esc key to exit RBSU. 11. Press the F10 key to confirm exiting RBSU. The node automatically reboots. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet.
Page 121: Troubleshooting
Troubleshooting Troubleshooting resources The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: •...
Page 122: Diagnostic Tools
Diagnostic tools UEFI System Utilities The UEFI System Utilities is embedded in the system ROM. The UEFI System Utilities enable you to perform a wide range of configuration activities, including: • Configuring system devices and installed options • Enabling and disabling system features •...
Page 123: Restoring And Customizing Configuration Settings
◦ Browse all FAT16 and FAT32 file systems. ◦ To add a new UEFI boot option, select an X64 UEFI application with an .EFI extension. For example, adding an OS boot loader or other UEFI application as a new UEFI boot option. The new boot option is appended to the boot-order list.
Page 124: Embedded Uefi Shell
• Secure Boot is not disabled and remains enabled. • The Boot Mode remains in UEFI Boot Mode even if the default boot mode is Legacy Boot Mode. • The Secure Boot Database is not restored to its default state. •...
Page 125: Hpe Proliant Pre-Boot Health Summary
Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis. 7. Enter the product ID and press the Enter key. 8. To confirm exiting System Utilities, press the F10 key. The node automatically reboots.
Page 126: Integrated Management Log
The Agentless Management Service is available in the SPP, which can be downloaded from the Hewlett Packard Enterprise website. The Active Health System log can be downloaded manually from iLO 4 or Intelligent Provisioning and sent to Hewlett Packard Enterprise. For more information, see the following documents: •...
Page 127: External Usb Functionality
External USB functionality Hewlett Packard Enterprise provides external USB support to enable local connection of USB devices for node administration, configuration, and diagnostic procedures. For additional security, external USB functionality can be disabled through USB options in UEFI System Utilities. Internal USB functionality An internal USB connector is available for use with security key devices and USB drive keys.
Page 128: Component Identification
Component identification Chassis front panel components • HPE Apollo r2200 Chassis Item Description Left bezel ear Low-profile LFF hot-plug drives Right bezel ear Chassis serial label pull tab • HPE Apollo r2600 Chassis Item Description Left bezel ear SFF SmartDrives Right bezel ear Chassis serial label pull tab Non-removable bezel blank...
Page 129: Chassis Front Panel Leds And Buttons
Item Description Left bezel ear SFF SmartDrives Right bezel ear Chassis serial label pull tab Non-removable bezel blank Chassis front panel LEDs and buttons Item Description Status Power On/Standby button and Solid green = System on system power LED (Node 1) Flashing green = Performing power on sequence Solid amber = System in standby Off = No power present...
Page 130 Item Description Status Health LED (Node 2) Solid green = Normal Flashing amber = System degraded Flashing red = System critical Health LED (Node 1) Solid green = Normal Flashing amber = System degraded Flashing red = System critical Health LED (Node 3) Solid green = Normal Flashing amber = System degraded Flashing red = System critical...
Page 131: Chassis Rear Panel Components
Chassis rear panel components Four 1U nodes Item Description Node 4 Node 3 RCM module (optional) Power supply 2 Power supply 1 Node 2 Node 1 Two 2U nodes Item Description Node 3 RCM module (optional) Power supply 2 Power supply 1 Node 1 Chassis rear panel components...
Page 132: Chassis Rear Panel Leds
Chassis rear panel LEDs Item Description Status Power supply 2 LED Solid green = Normal Off = One or more of the following conditions exists: • Power is unavailable • Power supply failed • Power supply is in standby mode •...
Page 133: Node Rear Panel Leds And Buttons
Item Description Node serial number and iLO label pull tab SUV connector USB 3.0 connector Dedicated iLO port (optional) NIC connector 1 NIC connector 2 2U node rear panel components Item Description Node serial number and iLO label pull tab SUV connector USB 3.0 connector Dedicated iLO port (optional)
Page 134 Item Description Status Power button/LED Solid green = System on Flashing green = Performing power on sequence Solid amber = System in standby Off = No power present UID button/LED Solid blue = Activated ◦ 1 flash per second = Remote management or firmware upgrade in progress ◦...
Page 135 Item Description Status iLO link LED Green = Linked to network Off = No network connection NIC link LED Green = Linked to network Off = No network connection NIC activity LED Green or flashing green = Network activity Off = No network activity When the LEDs described in this table flash simultaneously, a power fault has occurred.
Page 136: Power Fault Leds
Item Description Status Power button/LED Solid green = System on Flashing green = Performing power on sequence Solid amber = System in standby Off = No power present UID button/LED Solid blue = Activated ◦ 1 flash per second = Remote management or firmware upgrade in progress ◦...
Page 137: System Board Components
Subsystem LED behavior System board 1 flash Processor 2 flashes Memory 3 flashes Riser board PCIe slots 4 flashes FlexibleLOM 5 flashes Removable HPE Flexible Smart Array 6 flashes controller/Smart SAS HBA controller System board PCIe slots 7 flashes Power backplane or storage backplane 8 flashes Power supply 9 flashes...
Page 138: System Maintenance Switch
Item Description Dedicated iLO port connector NMI header PCIe x16 riser board connector* microSD slot System battery M.2 SSD riser connector TPM connector Processor 1 Processor 2 For more information on the riser board slots supported by the onboard PCI riser connectors, see PCIe riser board slot definitions.
Page 139: Nmi Functionality
CAUTION: Clearing CMOS, NVRAM, or both deletes configuration information. Be sure to configure the node properly to prevent data loss. IMPORTANT: Before using the S7 switch to change to Legacy BIOS Boot Mode, be sure the HPE Dynamic Smart Array B140i Controller is disabled. Do not use the B140i controller when the node is in Legacy BIOS Boot Mode.
Page 140: Fan Locations
Fan locations Drive bay numbering CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are populated with a component or a blank. NOTE: A SATA or mini-SAS cable must be installed in a node for the node to correspond to drives in the chassis.
Page 141: Hpe Apollo R2600 Chassis Drive Bay Numbering
HPE Apollo r2600 Chassis drive bay numbering One 1U node corresponds to a maximum of six SFF SmartDrives. • Node 1 corresponds to drive bays 1-1 through 1-6. • Node 2 corresponds to drive bays 2-1 through 2-6. • Node 3 corresponds to drive bays 3-1 through 3-6. •...
Page 142: Hpe Apollo R2800 Chassis Drive Bay Numbering
HPE Apollo r2800 Chassis drive bay numbering IMPORTANT: The HPE Apollo r2800 Chassis does not support nodes using the HPE Dynamic Smart Array B140i Controller or the HPE P840 Smart Array Controller. Hewlett Packard Enterprise recommends installing an HPE H240 Host Bus Adapter or HPE P440 Smart Array Controller. For information on drive bay mapping in the HPE Apollo r2800 Chassis and the factory default configuration, see "Drive bay mapping for the HPE Apollo r2800 Chassis."...
Page 143: Hot-Plug Drive Led Definitions
Bay 10 Hot-plug drive LED definitions SmartDrive hot-plug drive definitions Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Activity ring Rotating green Drive activity.
Page 144: Low-Profile Lff Hot-Plug Drive Led Definitions
Item Status Definition Drive status Solid green The drive is a member of one or more logical drives. Flashing green The drive is rebuilding or performing a RAID migration, strip size migration, capacity expansion, or logical drive extension, or is erasing. Flashing amber/green The drive is a member of one or more logical drives and predicts...
Page 145 Online/Activity LED (green) Fault/UID LED (amber/blue) Definition On, off, or flashing Alternating amber and blue One or more of the following conditions exist: • The drive has failed. • A predictive failure alert has been received for this drive. • The drive has been selected by a management application.
Page 146: Accelerator Numbering
Online/Activity LED (green) Fault/UID LED (amber/blue) Definition Solid amber A critical fault condition has been identified for this drive and the controller has placed it offline. Replace the drive as soon as possible. Flashing amber A predictive failure alert has been received for this drive.
Page 147: Rcm Module Components
Item Description Accelerator 1 Accelerator 2 For more information, see "Accelerators." RCM module components Item Description iLO connector HPE APM 2.0 connector iLO connector For more information, see "RCM module." RCM module components...
Page 148: Rcm Module Leds
RCM module LEDs Item Description iLO activity LED Green or flashing green = Network activity Off = No network activity iLO link LED Green = Linked to network Off = No network connection iLO link LED Green = Linked to network Off = No network connection iLO activity LED Green or flashing green = Network activity Off = No network activity...
Page 149 Form factor Slot number Slot description Storage controller or low-profile PCIe3 x16 (16, 8, 4, 1) for PCIe NIC card Processor 1 For more information on removing a storage controller, see "Expansion board." • Single-slot 1U right PCI riser cage assembly for Processor 2 (PN 798182-B21) Form factor Slot number Slot description...
Page 150 For more information on removing a storage controller, see "Expansion board." • Single-slot 1U right PCI riser cage assembly for Processor 1 (PN 819939-B21) Form factor Slot number Slot description Storage controller or low-profile PCIe3 x16 (16, 8, 4, 1) for PCIe NIC card Processor 1 For more information on removing a storage controller, see "Expansion board."...
Page 151 Form factor Slot number Slot description Storage controller or low-profile PCIe3x16 (16, 8, 4, 1) for PCIe NIC card Processor 1 For more information on removing a storage controller, see "Expansion board." • FlexibleLOM 2U node riser cage assembly (PN 798184-B21) Item Form factor Slot number...
Page 152 For more information on removing an accelerator, see "Accelerators." • Three-slot 11OS PCI riser cage assembly (PN 798186-B21) and Three-slot Enhanced 11OS PN PCI riser cage assembly (852767-B21) Item Form factor Slot number Slot description Accelerator card PCIe3 x16 (16, 8, 4, 1) for Processor 1 Storage controller or PCIe3 x16 (16, 8, 4, 1)
Page 153 Item Form factor Slot number Slot description Accelerator card PCIe3 x16 (16, 8, 4, 1) for Processor 2 Storage controller or PCIe3 x16 (8, 4, 1) for low-profile PCIe NIC Processor 2 card Accelerator card PCIe3 x16 (16, 8, 4, 1) for Processor 2 For more information on removing a storage controller, see "Expansion board."...
Page 154 Item Form factor Slot number Slot description Accelerator card PCIe3 x16 (16, 8, 4, 1) for Processor 2 Storage controller or PCIe3 x16 (8, 4, 1) for low-profile PCIe NIC Processor 2 card Accelerator card PCIe3 x16 (16, 8, 4, 1) for Processor 2 For more information on removing a storage controller, see "Expansion board."...
Page 155: Cabling
Cabling Chassis cabling Front I/O cabling Item Description Left front I/O cable Right front I/O cable Drive backplane power cabling HPE Apollo r2600 Chassis Cabling...
Page 156 Item Description Power cable for Node 1 and Node 2 Power cable for drives Power cable for Node 3 and Node 4 PDB Pass-through cable HPE Apollo r2200 Chassis Item Description Power cable for Node 1 and Node 2 Power cable for drives Power cable for Node 3 and Node 4 PDB Pass-through cable HPE Apollo r2800 Chassis...
Page 157: Rcm 2.0 Cabling
Item Description Power cable for Node 1 and Node 2 Power cable for drives Power cable for Node 3 and Node 4 PDB Pass-through cable RCM 2.0 cabling Fan power cabling HPE Apollo r2200 Chassis and HPE Apollo r2600 Chassis RCM 2.0 cabling...
Page 158 HPE Apollo r2800 Chassis Item Description PDB to left fan cage power cable Storage expander card to right fan cage power cable PDB to storage expander card fan power cable Cabling...
Page 159: Fan Module Cabling
Fan module cabling Item Description Fan 1 cable Fan 2 cable Fan 3 cable Fan 4 cable Fan 5 cable Fan 6 cable Fan 7 cable Fan 8 cable HPE Smart Storage Battery cabling Fan module cabling...
Page 160: Node Cabling
Node cabling SATA and Mini-SAS cabling B140i 1U node SATA cabling B140i 2U node SATA cabling Item Description Connection SATA 1 cable Mini-SAS connector 1 (SATA x4) on the system board to Port 1 on the bayonet board SATA 2 cable Mini-SAS connector 2 (SATA x4) on the system board to Port 2 on the bayonet board Node cabling...
Page 161 Mini-SAS H240 1U node cabling Mini-SAS H240 2U node cabling Mini-SAS P440 2U node cabling Mini-SAS P440/P840 node cabling HPE P440 Smart Array controller installed in a 1U node HPE P840 Smart Array controller installed in FlexibleLOM 2U node riser cage assembly Cabling...
Page 162: Fbwc Module Cabling
Item Description Connection Mini-SAS P440/P840 cable Port 1 on P840 Smart Array controller to Port 1 on the bayonet board Mini-SAS P440/P840 cable Port 2 on P840 Smart Array controller to Port 2 on the bayonet board FBWC module cabling The FBWC solution is a separately purchased option.
Page 163 HPE P440 Smart Array controller in a single-slot 1U node right PCI riser cage assembly HPE P440 Smart Array controller in a three-slot riser cage assembly Cabling...
Page 164: Accelerator Cabling
HPE P840 Smart Array controller in a FlexibleLOM 2U node riser cage assembly Accelerator cabling Accelerator cabling in the FlexibleLOM 2U node riser cage assembly NVIDIA Quadro K4200 GPU or NVIDIA Quadro M4000 GPU NVIDIA Tesla K40 GPU or AMD FirePro S9150 GPU Accelerator cabling...
Page 165: Accelerator Cabling In A Three-Slot Riser Cage Assembly
NOTE: Depending on the accelerator model purchased, the accelerator and cabling might look slightly different than shown. Intel Xeon Phi Coprocessor 5110P IMPORTANT: If installing an Intel Xeon Phi Coprocessor 5110P, connect the power cable to the 2x4 connector only. Do not connect the power cable to the 2x3 connector.
Page 166 Item Description Accelerator 2 power cable (PN 825635-001) Accelerator 1 power cable (PN 825634-001) Dual NVIDIA Tesla K40 GPUs, NVIDIA GRID K2 Reverse Air Flow GPUs, AMD FirePro S9150 GPUs, or AMD FirePro S7150 GPUs Item Description Accelerator 2 power cable (PN 825635-001) Accelerator 1 power cable (PN 825634-001) Dual Intel Xeon Phi Coprocessor 5110P Cabling...
Page 167 Item Description Accelerator 2 power cable (PN 825635-001) Accelerator 1 power cable (PN 825634-001) Single NVIDIA Tesla K80 GPU, NVIDIA Tesla M60 GPU, NVIDIA Tesla M40 GPU, NVIDIA Tesla P40 GPU, or NVIDIA Tesla P100 GPU Item Description Accelerator 2 power cable (PN 825637-001) Accelerator 1 power cable (PN 825636-001) Dual NVIDIA Tesla K80 GPUs, NVIDIA Tesla M60 GPUs, NVIDIA Tesla M40 GPUs, NVIDIA Tesla P40 GPU, or NVIDIA Tesla P100 GPUs...
Page 168: 2-Pin Adapter Cables
Item Description Accelerator 2 power cable (PN 825637-001) Accelerator 1 power cable (PN 825636-001) 2-pin adapter cables Single NVIDIA GRID K2 Reverse Air Flow GPU Dual NVIDIA GRID K2 Reverse Air Flow GPUs 2-pin adapter cables...
Page 169: Specifications
Specifications Environmental specifications Specification Value Temperature range — Operating 10°C to 35°C (50°F to 95°F) Nonoperating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing) — Operating Minimum to be the higher (more moisture) of -12°C (10.4°F) dew point or 8% relative humidity Maximum to be 24°C (75.2°F) dew point or 90% relative humidity Nonoperating...
Page 170 Specifications Value Dimensions — Height 8.73 cm (3.44 in) Depth 82.27 cm (32.40 in) Width 44.81 cm (17.64 in) Weight (approximate values) — Weight (maximum) 23.45 kg (51.70 lb) Weight (minimum) 9.86 kg (21.74 lb) HPE Apollo r2800 Chassis (24 SFF with storage expander backplane) Specifications Value Dimensions...
Page 171: Power Supply Specifications
Specifications Value Weight (maximum) 6.47 kg (14.27lb) Weight (minimum) 4.73 kg (10.43 lb) Power supply specifications CAUTION: Do not mix power supplies with different efficiency and wattage in the chassis. Install only one type of power supply. Verify that all power supplies have the same part number and label color. The system becomes unstable and may shut down when it detects mismatched power supplies.
Page 172 Expansion boards installed in slot 2 of the FlexibleLOM 2U node riser cage assembly (PN 798184-B21) Description Maximum inlet ambient temperature Low-profile or single-width PCIe card (such as the 20°C (68°F) P440 Smart Array controller or P840 Smart Array controller) Single-width GPU accelerator (such as the NVIDIA 21°C (69.8°F) Quadro M4000 or the NVIDIA Quadro K4200)
Page 173 PCIe NIC cards Description Maximum inlet ambient temperature InfiniBand EDR/EN 100-GB 1-port 840QSFP28 20°C (68°F) if using an optical fiber cable in a 2U Adapter node 21°C (69.8°F) if using an optical fiber cable in a 1U node 22°C (71.6°F) if using a copper direct-attach cable in a 2U node 23°C (73.4°F) if using a copper cable in a 1U node InfiniBand EDR/EN 100-GB 2-port 840QSFP28...
Page 174: Websites
Websites General websites Hewlett Packard Enterprise Information Library www.hpe.com/info/EIL Single Point of Connectivity Knowledge (SPOCK) Storage compatibility matrix www.hpe.com/storage/spock Storage white papers and analyst reports www.hpe.com/storage/whitepapers Websites...
Page 175: Documentation Feedback
Documentation feedback Hewlett Packard Enterprise is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback. When submitting your feedback, include the document title, part number, edition, and publication date located on the front cover of the document.
Page 176: Acronyms And Abbreviations
Customer Self Repair double data rate DIMMs per channel EuroAsian Economic Commission FBWC flash-backed write cache graphics processing unit HP SUM HP Smart Update Manager HPE APM HPE Advanced Power Manager HPE SIM HPE Systems Insight Manager Acronyms and abbreviations...
Page 177 HPE SSA HPE Smart Storage Administrator International Electrotechnical Commission Integrated Lights-Out Integrated Management Log International Organization for Standardization large form factor LAN on Motherboard LRDIMM load reduced dual in-line memory module network interface controller nonmaskable interrupt NVRAM nonvolatile memory Onboard Administrator PCIe Peripheral Component Interconnect Express power distribution board...
Page 178 RDIMM registered dual in-line memory module Remote Desktop Protocol RoHS Restriction of Hazardous Substances redundant power supply serial attached SCSI SATA serial ATA small form factor Systems Insight Manager Service Pack for ProLiant serial, USB, video TMRA recommended ambient operating temperature Trusted Platform Module UEFI Unified Extensible Firmware Interface...

HP Apollo 2000 System Maintenance And Service Manual

HPE Apollo 2000 System

Customer Self Repair

Illustrated Parts Catalog

Removal and Replacement Procedures

Troubleshooting

Diagnostic Tools

Component Identification

Cabling

Specifications

Websites

Documentation Feedback

Acronyms and Abbreviations

Quick Links

Related Manuals for HP Apollo 2000 System

Summary of Contents for HP Apollo 2000 System

Table of Contents