Section 1.7, "Powerpc 603 Microprocessor Package Description - Motorola PowerPC 603 Hardware Specifications

Table 10. PowerPC 603 Microprocessor Pinout Listing (Continued)
Signal Name
TS
TT[0–4]
VDD
WT
XATS
Notes:
1. These are test signals for factory use only and must be pulled up to Vdd for normal machine operation.
2. OVdd inputs supply power to the I/O drivers and Vdd inputs supply power to the processor core. Future
members of the 603 family may use different OVdd and Vdd input levels; for example, OVdd = 3.3 V or
5.0 V, with Vdd = 2.5 V.
1.7 PowerPC 603 Microprocessor Package
Description
The following sections provide the package parameters and the mechanical dimensions for the 603. Note
that the 603 is currently offered in two types of CQFP packages—the Motorola wire-bond CQFP and the
IBM C4-CQFP.
1.7.1 Motorola Wire-Bond CQFP Package Description
The following sections provide the package parameters and mechanical dimensions for the Motorola wire-
bond CQFP package.
1.7.1.1 Package Parameters
The package parameters for the Motorola wire-bond CQFP are as provided in the following list. The
package type is 32 mm x 32 mm, 240-pin ceramic quad flat pack.
Package outline
Interconnects
Pitch
Maximum module height
603 Hardware Specifications
Pin Number
149
191, 190, 185, 184, 180
4, 14, 24, 34, 44, 59, 122, 137, 147, 157, 167, 177, 207
236
150
32 mm x 32 mm
240
0.5 mm (20 mil)
4.15 mm
Active I/O
Low I/O
High I/O
High Input
Low Output
Low I/O
17