Motorola PowerPC 603 Hardware Specifications page 19

1.7.2 IBM C4-CQFP Package Description
The following sections provide the package parameters and mechanical dimensions for the IBM C4-CQFP
package.
1.7.2.1 Package Parameters
The package parameters for the IBM C4-CQFP are as provided in the following list. The package type is
32 mm x 32 mm, 240-pin ceramic quad flat pack.
Package outline
Interconnects
Pitch
Lead plating
Solder joint
Lead encapsulation
Solder-bump encapsulation
Maximum module height
Co-planarity specification
Note: No solvent can be used with the C4-CQFP package. See Appendix A, "General Handling
Recommendations for the C4-CQFP Package," for details.
603 Hardware Specifications
32 mm x 32 mm
240
0.5 mm
Ni Au
Sn/PB (10/90)
Epoxy
Epoxy
3.1 mm
0.08 mm
19