Motorola PowerPC 603 Hardware Specifications page 30

During the card assembly process, no solvent can be used with the C4FP, and no more than 3 Kg of force
must be applied normal to the top of the package prior to, during, or after card assembly. Other details of
the card assembly process follow:
Solder paste
Solder stencil thickness
Solder stencil aperature
Placement tool
Solder reflow
Solder reflow profile
Clean after reflow
Touch-up and repair
C4FP removal
C4FP replace
30
Either water soluble (for example, Alpha 1208) or no clean
0.152 mm
Width reduced to 0.03 mm from the board pad width
Panasonic MPA3 or equivalent
Infrared, convection, or vapor phase
Infrared and/or convection
• Average ramp-up—0.48 to 1.8 °C/second
• Time above 183 °C—45 to 145 seconds
• Minimum lead temperature—200 °C
• Maximum lead temperature—240 °C
• Maximum C4FP temperature—245 °C
Vapor phase
• Preheat (board)—60 °C to 150 °C
• Time above 183 °C—60 to 145 seconds
• Minimum lead temperature—200 °C
• Maximum C4FP temperature—220 °C
• Egress temperature—below 150 °C
De-ionized (D.I.) water if water-soluble paste is used
• Cleaner requirements—conveyorized, in-line
• Minimum of four washing chambers
— Pre-clean chamber: top and bottom sprays, minimum top-side
pressure of 25 psig, water temperature of 70 °C minimum, dwell
time of 24 seconds minimum, water is not re-used, water flow rate
of 30 liters/minute.
— Wash chamber #1: top and bottom sprays, minimum top-side
pressure of 48 psig, minimum bottom-side pressure of 44 psig,
water temperature of 62.5 °C (±2.5 °C), dwell time of 48 seconds
minimum, water flow rate of 350 liters/minute.
— Wash chamber #2: top and bottom sprays, minimum top-side
pressure of 32 psig, minimum bottom-side pressure of 28 psig,
water temperature of 72.5 °C (±2.5 °C), dwell time of 48 seconds
minimum, water flow rate of 325 liters/minute.
— Final rinse chamber: top and bottom sprays, minimum top-side
pressure of 25 psig, water temperature of 72.5 °C minimum, dwell
time of 24 seconds minimum, water flow rate of 30 liters/minute.
• No cleaning required if "no clean solder paste" is used
Water soluble (for example, Kester 450) or No Clean Flux
Hot air rework
Hand solder
603 Hardware Specifications