Package Thermal Characteristics; Pin Capacitance - Motorola DigitalDNA MPC180E User Manual

Package Thermal Characteristics

9.2 Package Thermal Characteristics
Table 9-2 shows the thermal resistances for the 100 pin LQFP package.
Table 9-2. Package Thermal Characteristics
1,2
Junction to ambient (@200Ifm)
3
Junction to board (bottom)
4
Junction to case (top)
1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, board population, and board thermal resistance.
2
Per SEMI G38-87.
3
Indicates the average thermal resistance between the die and the printed circuit board.
4
Indicates the average thermal resistance between the die and the case top surface via the cold plate
method (MIL SPEC-883 Method 1012.1).

9.3 Pin Capacitance

Table 9-3 shows the pin capacitances for the input and I/O pins.
Parameter
Input capacitance
Input/output capacitance
1
f = 1.0MHz, TA = 0 to 70∞C, periodically sampled rather than 100% tested
9-2
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Rating
Table 9-3. Capacitance
MPC180E Security Processor User's Manual
Symbol
Single–layer board R
Four–layer board
R
R
1
Symbol Min Typ
C — 5
in
C — 5
I/O
Max Unit
°
40 C/W
25
°
17 C/W
°
9 C/W
Max Unit
7 pF
7 pF