Table of Contents
Advertisement
1.7.2.2 Mechanical Dimensions of the IBM C4-CQFP Package
Figure 11 shows the mechanical dimensions for the IBM C4-CQFP package.
Epoxy Dam
Urethane
Clip Leadframe
C
-C-
*Reduced pin count shown for clarity. 60 pins per side
Pin 240
Pin 1
Figure 11. Mechanical Dimensions of the IBM C4-CQFP Package
20
Solder-Bump Encapsulant
Chip
F
Tape Cast Ceramic
A
0.13 TOTAL s
A-B
-A-
B
0.13 TOTAL s
A-B
G
0.08
E
-B-
D
0.08 TOTAL M
Radius
Ang
Jmin
H
min
max
A
31.8
32.2
B
34.4
34.8
C
2.33
2.93
D
0.45
0.55
E
0.18
0.28
F
0.585
0.685
G
0.12
0.20
H
0.40
0.60
Jmin
0.30
0.40
Ang
0.0°
5.0°
Rad
—
0.25
A-B
* Not to scale
All measurements in mm
603 Hardware Specifications
Advertisement
Table of Contents
