Table of Contents
Advertisement
Technical Specifications
Indicators:
Dimensions:
Weight:
Supply Voltage
Power Consumption:
Operating Temperature:
TRANSMITTER Specifications:
Number of SDI Inputs
Data Rate Range
Supported Standards
Re-clocked Data Rates
Equalization
Return Loss
Number of Loop Outs
Number of Optical Outputs 2
DC Signal Level
DC Offset
Overshoot
Timing Jitter
Alignment Jitter
Rise/Fall Time
Re-clocking
Revision E
(3) Power, Data Rate SD, HD, 3G – Lock Detect - Active
3G = 4.96 x 2.25 x 1.03 (in) – 125.98 x 57.12 x 26.14 (mm)
3G+ = Height: 1.68" (4.3cm) Depth: 3.427" (8.7cm) Width: 5.609"
(14.25 cm)
3G+ RM = Rack Size: EIA 19" Height: 1U-1.72" (4.40 cm) Depth:
18.02" (45.8 cm) Width: 17.49" (44.5 cm)
(Tolerance: ± .039"; .100cm)
3G = ~ 1 lb. (~0.45 kg.)
3G+ = <1lb (0.45kg) each Shipping Weight: 4lb (1.81kg) pair
3G+ RM = 15 lbs (4.99 kg) per unit Shipping Weight: 30 lbs (12.25
kg) pair
3G and 3G+= 5-14 VDC
3G+ RM =90-264 VAC, 47-63 Hz, Universal AC Power Supplies
3G and 3G+ = 6 Watts per unit
3G+ RM = 30 Watts fully loaded per unit
0º C to +50º C; (32° -122° F)
1 - 2
270Mbps to 2.97 Gbps
SMPTE 424M, 292M, 259M, 372M and 425 level A and B compliant
270 Mbps (SMPTE 259M), 1.485 Gbps (SMPTE 292), 2.97 Gbps
(SMPTE 424M)
Automatic up to 140m of Belden 1694A at 3.0 Gbps, 230m at 1.485
Gbps and 350m at 270 Mbps
>10dB up to 2.97 Gbps
1
800mV ± 10%
0V ± 0.5V
< 10% of amplitude
< 0.2 UI at 270 Mbps; < 1.0 UI at 1.485 Gbps;
< 2 UI at 2.97 Gbps with color bar signal
< 0.2 UI at 270 Mbps 1.485 Gbps;
< 0.3 UI at 2.97 Gbps with color bar signal
0.4 ns to 1.5 ns at 270 Mbps per SMPTE 259M
< 270 ps at 1.485 Gbps per SMPTE 292;
< 135 ps at 2.97 Gbps per SMPTE 424M;
At 270 Mbps, 1.485 Gbps, and 2.97 Gbps
7
July 2012
Advertisement
Table of Contents
