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2.1 System design
The IBM Power 595 Enterprise Class structure is the result of the continuous evolution of 595
through pSeries®. Its structure and design have been continuously improved, adding more
capacity, performance, functionality, and connectivity, while considering the balanced system
approach for memory sizes, internal bandwidth, processing capacity, and connectivity. The
objective of the 595 system structure and design is to offer a flexible and robust infrastructure
to accommodate a wide range of operating systems and applications, either traditional or
based on WebSphere, Java, and Linux for integration and deployment in heterogeneous
business solutions. The Power 595 is based on a modular design, in which all components
are mounted in 24-inch racks. Inside this rack, all the server components are placed in
specific positions. This design and mechanical organization offer advantages in optimization
of floor space usage.
2.1.1 Design highlights
The IBM Power 595 (9119-FHA) is a high-end POWER6 processor-based symmetric
multiprocessing (SMP) system. To avoid any possible confusion with earlier POWER5 model
595 systems, we will hereafter refer to the current system as the Power 595. The Power 595 is
based on a modular design, where all components are mounted in 24-inch racks. Inside this
rack, all the server components are placed in specific positions. This design and mechanical
organization offer advantages in optimization of floor space usage.
Conceptually, the Power 595 is similar to the IBM eServer™ p5 595 and i5 595, which use
POWER5 technology, and can be configured in one (primary) or multiple racks (primary plus
expansions). The primary Power 595 frame is a 42U, 24-inch based primary rack, containing
major subsystems, which as shown in Figure 2-2 on page 39, from top to bottom, include:
A 42U-tall, 24-inch system rack (primary) houses the major subsystems.
A redundant power subsystem housed in the Bulk Power Assemblies (BPA's) located in
front and rear at the top 8U of the system rack, has optional battery backup capability.
A 20U-tall Central Electronics Complex (CEC) houses the system backplane cooling fans
and system electronic components.
One to eight, 8-core, POWER6 based processor books are mounted in the CEC. Each
processor book incorporates 32 memory dual in-line memory module (DIMM) slots.
Integrated battery feature (IBF) for backup is optional.
Media drawer is optional.
One to 30 I/O drawers each contains 20 PCI-X slots and 16 hot-swap SCSI-3 disk bays.
In addition, depending on the configuration, it is possible to have:
One or two powered expansion racks, each with 32U worth of rack space for up to eight
4U I/O drawers. Each powered expansion rack supports a 42U bolt-on, nonpowered
expansion rack for mounting additional I/O drawers as supported by the 595 I/O expansion
rules.
One to two nonpowered expansion racks, each supporting up to seven I/O drawers, 4Us
high.
Note: Nonpowered expansion racks must be attached to a powered expansion rack.
Maximum configuration can be up to five racks: One primary rack, two powered expansion
racks, and two nonpowered expansion racks
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IBM Power 595 Technical Overview and Introduction
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