Center Electronic Complex (Cec) - IBM Power 595 Technical Overview And Introduction

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Figure 2-3 Power 595 rear view

2.1.2 Center electronic complex (CEC)

The Power 595 CEC is a 20U tall, 24-inch rack-mounted device. It houses the system
processors, memory, redundant system service processors, I/O drawer connection capability,
and associated components. The CEC is installed directly below the power subsystem.
The CEC features a packaging concept based on books. The books contain processors
memory, and connectors to I/O drawers and other servers. These books will hereafter be
referred to as
mounted in the primary rack.
Each Processor book assembly contains many components, some of which include:
The processor book planar provides support for four multichip modules (MCM), 32
memory DIMM slots, a connector to the mid-plane, four I/O adapter connectors, two node
controller connectors, and one VPD card connector.
A node power distribution planar provides support for all DCA connectors, memory, and air
temperature sensors.
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IBM Power 595 Technical Overview and Introduction
Rear View Rear View
processor books
. The processor books are located in the CEC, which is
Bulk Power Bulk Power
Assembly Assembly
(BPA) (BPA)
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Motor Drive
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Assembly
MDA
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IO IO
Drawers Drawers
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Device-
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