Thermal Management; Thermal Operation And Configuration Requirements - Intel R1000GZ Technical Product Specification

4.

Thermal Management

The fully integrated system is designed to operate at external ambient temperatures of between 10ºC- 35ºC
with limited excursion based operation up to 45ºC, as specified in Table 3. System Environmental Limits
Summary. Working with integrated platform management, several features within the system are designed to
move air in a front to back direction, through the system and over critical components in order to prevent them
from overheating and allow the system to operate with best performance.
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The Intel Server System R1000GZ/GL product family supports short-term, excursion-based, operation up to
45°C (ASHRAE A4) with limited performance impact. The configuration requirements and limitations are
described in the configuration matrix found in the Intel
Configuration Tool, available as a download online at Intel.com.
The installation and functionality of several system components are used to maintain system thermals. They
include six managed dual rotor 40mm x 56mm system fans, one integrated 40mm fan for each installed power
supply module, an air duct, populated hard drive carriers, and installed CPU heats sinks. Hard drive carriers
can be populated with a hard drive or supplied drive blank. In addition, it may be necessary to have specific
DIMM slots populated with DIMMs or supplied DIMM blanks.
4.1

Thermal Operation and Configuration Requirements

To keep the system operating within supported maximum thermal limits, the system must meet the following
operating and configuration guidelines:
• The system operating ambient is designed for sustained operation up to 35ºC (ASHRAE Class A2) with
short term excursion based operation up to 45ºC (ASHRAE Class A4).
o The system can operate up to 40ºC (ASHRAE Class A3) for up to 900 hours per year
o The system can operate up to 45ºC (ASHRAE Class A4) for up to 90 hours per year
o When operating within the extended operating temperature range, then system performance
may be impacted.
o There is no long term system reliability impact when operating at the extended temperature
range within the approved limits.
• Specific configuration requirements and limitations are documented in the configuration matrix found in
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the Intel
Server Board S2600GZGL product family Power Budget and Thermal Configuration
Guidelines Tool, available as a download online at Intel.com.
• The CPU-1 processor + CPU heat sink must be installed first. The CPU-2 heat sink must be installed
at all times, with or without a processor installed.
Memory Slot population requirements –
•
NOTE: Specified memory slots can be populated with a DIMM or supplied DIMM Blank. Memory
population rules apply when installing DIMMs.
o DIMM Population Rules on CPU-1 – Install DIMMs in order; Channels A, B, C, and D
with1st DIMM (Blue Slot) on each channel, then slot 2, then slot 3
installed DIMM blanks when populating the slot with an actual memory module.
o DIMM Population Rules on CPU-2 – Install DIMMs in order; Channels E, F, G, and H
with1st DIMM (Blue Slot) on each channel, then slot 2, then slot 3
installed DIMM blanks when populating the slot with an actual memory module.
o The following system configuration requires that specific memory slots be populated at all times
using either a DIMM or supplied DIMM Blank
 System Configuration - 8x 2.5" hard drive bay configuration + 24 DIMM server board
Memory slot 3 for all memory channels

• All hard drive bays must be populated. Hard drive carriers can be populated with a hard drive or
supplied drive blank.
• The air duct must be installed at all times
1
24-DIMM Intel® Server Board S2600GZ only
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Intel Server System R1000GZ/GL Product Family TPS
Revision 1.1
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S2600GZG Product Family Power Budget and Thermal
1 . Start
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. Only remove factory
1
. Start
1
. Only remove factory
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