A Package Type - IBM MiEM78P468L Product Specification

A Package Type

EM78P468LH
EM78P468NQ
EM78P468NQS/NQJ
EM78P468NAQ
EM78P468NAQS/NAQJ
EM78P468NBQ
EM78P468NBQS/NBQJ
EM78P468NCQ
EM78P468NCQS/NCQJ
Note: Green products do not contain hazardous substances.
These are compatible with the third edition of Sony SS-00259 standard.
The Pb content should be less than 100ppm, and should meet Sony specifications or
requirements.
Electroplate type
Ingredient (%)
Melting point (°C)
Electrical resistivity (μΩ-cm)
Hardness (hv)
Elongation (%)
Product Specification (V1.5) 02.15.2007
(This specification is subject to change without further notice)
APPENDIX
Name Package Type
Part No.
EM78P468N/EM78P468L
Pin Count
Dice 59
QFP 64
QFP 64
LQFP 64
LQFP 64
LQFP 44
LQFP 44
QFP 44
QFP 44
EM78P468NxS/xJ
Pure Tin
Sn:100%
232°C
11.4
8~10
>50%
8-Bit Microcontroller
Package Size
−
14 mm × 20 mm
14 mm × 20 mm
7 mm × 7 mm
7 mm × 7 mm
10 mm × 10 mm
10 mm × 10 mm
10 mm × 10 mm
10 mm × 10 mm
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