Bonding Driver Options; Bonding Driver Parameters; Arp_Ip_Target - Qlogic 3000 Series User Manual

Intelligent ethernet adapters
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7–Linux Configuration for Bonding Mode and Virtual LAN (VLAN)
Linux Bonding Mode
The output for this command is:
Ethernet Channel Bonding Driver: v3.0.1 (January 9, 2006)
Bonding Mode: load balancing (round-robin) MII Status: up MII
Polling Interval (ms): 100 Up Delay (ms): 50000 Down Delay (ms): 0
Slave Interface: eth16
MII Status: up
Link Failure Count: 0
Permanent HW addr: 00:0e:1e:00:11:d2
Slave Interface: eth15
MII Status: up
Link Failure Count: 0
Permanent HW addr: 00:0e:1e:00:11:d3
The dmesg command output is:
bonding: bond0: link status definitely up for interface eth16.
bonding: bond0: link status definitely up for interface eth15.

Bonding Driver Options

Options for the bonding driver are supplied as parameters to the bonding module
at load time. They may be given as command line arguments to the modprobe
command, but are usually specified in the /etc/modules.conf or
/etc/modprobe.conf configuration file, or in a distribution-specific
configuration file (some of which are detailed in the next section).

Bonding Driver Parameters

The available bonding driver parameters are listed in the following sections. If a
parameter is not specified, the default value is used. When initially configuring a
bond, QLogic recommends that tail -f /var/log/messages be run in a
separate window to watch for bonding driver error messages.
It is critical to specify the following parameters; otherwise, serious network
degradation will occur during link failures.
miimon or arp_interval and

arp_ip_target

Most devices support miimon, so it is safe to use.
Options with textual values will accept either the text name or, for backwards
compatibility, the option value. For example, mode=802.3ad and mode=4 set the
same mode.
7-4
<=========== up state
<=========== up state
NE0154601-00 A

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