Related Documents; Terminology - Intel 6 SERIES CHIPSET - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

1.1

Related Documents

The reader of this specification should also be familiar with material and concepts
presented in the following documents.
®
Intel 6 Series Chipset Datasheet
®
Intel 6 Series Chipset Specification Update
nd
2 Generation Intel® Core™ Processor and LGA1155 Socket Thermal
Mechanical Specifications and Design Guidelines
Thermally Advantaged Chassis Design Guidelines
Various system thermal design suggestions
1.2

Terminology

BLT
CTE
FC-BGA
MD
PCH
SMD
TDP
TIM
8
Title
Item
Bond Line Thickness. Final settled thickness of the thermal interface material
after installation of the heatsink.
Coefficient of Thermal Expansion. The relative rate a material expands during a
thermal event.
Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a
die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls attached
to the substrate opposite the die. Note that the device arrives at the customer
with solder balls attached.
Metal Defined pad is one where a pad is individually etched into the PCB with a
minimum width trace exiting it
Platform Controller Hub. The PCH is connected to the processor via the Direct
Media Interface (DMI) and the Intel
The Solder Mask Defined pad is typically a pad in a flood plane where the solder
mask opening defines the pad size for soldering to the component.
Thermal design power. Thermal solutions should be designed to dissipate this
power level. TDP is not the peak power that the PCH can dissipate.
Thermal Interface Material. A conductive material used between the component
and heatsink to improve thermal conduction.
www.intel.com/Assets/PDF/
specupdate/324645.pdf
www.intel.com/Assets/PDF/
specupdate/324646.pdf
http://download.intel.com/
design/processor/specupdt/
324644.pdf
http://www3.intel.com/cd/
channel/reseller/asmo-na/eng/
products/53211.htm
http://www.formfactors.org
Description
®
Flexible Display Interface (Intel
§ §
Thermal Mechanical Specifications and Design Guidelines
Introduction
Location
®
FDI)