Table Of Contents - Intel 6 SERIES CHIPSET - THERMAL MECHANICAL SPECIFICATIONS AND DESIGN GUIDELINES 01-2011 Specifications

Contents
1 Introduction .............................................................................................................. 7
1.1 Related Documents ............................................................................................. 8
1.2 Terminology ....................................................................................................... 8
2 Packaging Mechanical Specifications ......................................................................... 9
2.1 PCH Package for Single Processor Desktop.............................................................. 9
2.2 Solder Balls ...................................................................................................... 11
2.3 Package Mechanical Requirements ....................................................................... 12
3 Thermal Specifications ............................................................................................ 13
3.1 Thermal Design Power (TDP) .............................................................................. 13
3.2 Thermal Specifications ....................................................................................... 13
3.3 Storage Specifications........................................................................................ 16
4 Thermal Simulation ................................................................................................. 17
5 Thermal Metrology .................................................................................................. 19
5.1 Tcase Temperature Measurements....................................................................... 19
5.1.1 Heatsink Thermocouple Attach Methodology .............................................. 19
5.2 Ambient Temperature and Airflow Measurement .................................................... 21
6 ATX Reference Thermal Solution.............................................................................. 23
6.1 Reference Solution ............................................................................................ 23
6.2 Environmental Reliability Requirements ................................................................ 24
A Thermal Solution Component Vendors ..................................................................... 25
B Mechanical Drawings for Package and Reference Thermal Solution ......................... 27
Thermal Mechanical Specifications and Design Guidelines 3