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The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 25
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 25.
Processor Thermal Specifications
Core
Processor
Frequency
Number
(GHz)
E3500
2.70
E3400
2.60
E3300
2.50
E3200
2.40
NOTES:
1.
Specification is at 36 °C T
design characterization and not 100% tested.
2.
Specification is at 34 °C T
design characterization and not 100% tested.
3.
Thermal Design Power (TDP) should be used for processor thermal solution design targets.
The TDP is not the maximum power that the processor can dissipate.
4.
This table shows the maximum TDP for a given frequency range. Individual processors
may have a lower TDP. Therefore, the maximum T
individual processor. Refer to thermal profile figure and associated table for the allowed
combinations of power and T
5.
775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal
requirements.
76
instead of the maximum processor power consumption. The Thermal Monitor
Thermal
Extended
Design
HALT
Power
Power
3,4
1
(W)
(W)
65.0
8
65.0
8
65.0
8
65.0
8
and minimum voltage loadline. Specification is ensured by
C
and minimum voltage loadline. Specification is ensured by
C
Thermal Specifications and Design Considerations
Section
5.2. In all cases the Thermal Monitor or
Deeper
775_VR_
Sleep
CONFIG_06
Power
5
Guidance
2
(W)
6
775_VR_CONFIG
6
_06
6
(65 W)
6
will vary depending on the TDP of the
C
.
C
Minimum
Maximum
Notes
T
(°C)
T
(°C)
C
C
See
5
5
Table 26
5
and
5
Figure 13
Datasheet
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