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Summary of Contents for SIGMATEK X-DIAS
- Page 1 X-DIAS Designguide Instruction Manual Date of creation: 23.05.2024 Version date: 04.02.2025 Article number: 20-0XX-XXX-E...
- Page 2 (print, photocopy, microfilm or in any other process) without express permission. We reserve the right to make changes in the content without notice. SIGMATEK GmbH & Co KG is not responsible for technical or printing errors in this handbook and assumes no responsibility for damages that occur through...
- Page 3 DESIGNGUIDE X-DIAS Designguide X-DIAS The X-DIAS design guide defines the general rules for the integration of X-DIAS modules on a wiring board and their connection to an S-DIAS system. Possible example of an X-DIAS wiring board with S-DIAS connection: 04.02.2025...
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Page 4: Table Of Contents
3 Electrical Design Specifications 3.1 Area Allocation 3.2 S-DIAS Bus 3.2.1 Connector Layout Bus 3.2.1.1 S-DIAS Interface Connector (S-DIAS Adapter Module => X-DIAS Module) 17 3.2.1.2 S-DIAS Interface Connector (X-DIAS Module => S-DIAS Module) 3.2.1.3 X-DIAS Connector 3.2.2 Bus Routing 3.2.3 +24 V Bus Supply... - Page 5 DESIGNGUIDE X-DIAS 3.5.1.2 Inner Layer 1 3.5.1.3 Inner Layer 2 3.5.1.4 Bottom Layer 3.5.1.5 Further Layers 04.02.2025 Page 3...
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Page 6: Technical Requirements Wiring Board
16-pin printed circuit board Tyco 464824-E or Harting 15 11 016 2601 000 connector for S-DIAS interface on wiring board 40-pin socket strip for X-DIAS Samtec SSQ-120-01-L-D modules on wiring board Impedance of the S-DIAS bus 100 Ω Functional grounding X-DIAS... -
Page 7: Mechanical Design Specifications
2 Mechanical Design Specifications 2.1 Module Placement It is recommended to place the X-DIAS modules on the top left of the wiring board so that there is a clean separation between the bus and I/Os. The power supply and bus connection for the X-DIAS modules is provided from the left via the S-DIAS adapter module and S-DIAS flat ribbon cable (40 mm). - Page 8 S-DIAS modules, the Y-distance from the drill hole of the upper snap-in hook of the X-DIAS module to the center of the top-hat rail of the S-DIAS modules must be 47.6 mm. Furthermore, the distance from the drill hole of the upper snap-in hook of the X-DIAS module to the center of the 16-pin connector for the S-DIAS interface must be 14.6 mm.
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Page 9: Mounting Distances
X-DIAS 2.1.1 Mounting Distances To ensure that the blue or yellow covers of the X-DIAS modules is at the same height as the covers of the S-DIAS modules, the following lengths are recommended for the spacer sockets for the control cabinet mounting plate with a printed circuit board thickness of 1.6 mm. - Page 10 X-DIAS DESIGNGUIDE To ensure that the module can be connected and disconnected correctly, a minimum distance of 10 mm from the top must be maintained for components. A distance of 15 mm must be maintained at the bottom for the slight downward rotation of the module, so that there is sufficient space for high components when plugging and unplugging the module.
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Page 11: Mounting
X-DIAS 2.1.2 Mounting The X-DIAS modules are designed for mounting on a wiring board in the control cabinet. The functional grounding of the X-DIAS modules is carried out via their GND connection on the wiring board. The wiring board must be connected to the grounded switch cabinet mounting plate with low resistance via the mounting screws. - Page 12 X-DIAS DESIGNGUIDE Recommended minimum distances between the X-DIAS modules and the surrounding components or control cabinet wall: a, b, c … distances in mm (inches) Page 10 04.02.2025...
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Page 13: Footprint
DESIGNGUIDE X-DIAS 2.1.3 Footprint INFORMATION The footprint is available as a DXF file. 04.02.2025 Page 11... -
Page 14: Coding
X-DIAS DESIGNGUIDE 2.2 Coding X-DIAS modules have module coding by means of coding pins on the module housing. In combination with coding holes on the wiring board, a mismating protection can be realized, e.g. module coding XDM 161: Position 1... -
Page 15: Connect Module
DESIGNGUIDE X-DIAS 2.2.2 Connect Module When connecting the X-DIAS modules, they must first be hooked in with the lower snap-in hook and then pushed upwards in a slight twisting motion until the upper snap-in hook engages. INFORMATION The modules may only be connected and disconnected when they are de- energized. -
Page 16: Disconnect Module
X-DIAS DESIGNGUIDE 2.2.3 Disconnect Module A slotted screwdriver is required to disconnect the modules. This must be inserted into the tab parallel to the module. By exerting controlled downward pressure on the handle of the screwdriver, the module is unlocked at the top and can then be removed with a slight downward turning movement. -
Page 17: Electrical Design Specifications
DESIGNGUIDE X-DIAS 3 Electrical Design Specifications 3.1 Area Allocation The wiring board is divided into 2 areas: The routing of the S-DIAS bus supply and the S-DIAS bus takes place in the S-DIAS bus area. The routing of the I/O supply and the routing of the I/Os takes place in the I/O area. -
Page 18: S-Dias Bus
DESIGNGUIDE 3.2 S-DIAS Bus The X-DIAS modules are supplied with +24 V bus/GND from the S-DIAS bus. The bus itself consists of a differential Tx and Rx bus on LVDS physics with 100 Mbits/s data rate. If the S- DIAS bus is continued on the last X-DIAS module to connect further S-DIAS modules, the S-... -
Page 19: Connector Layout Bus
DESIGNGUIDE X-DIAS 3.2.1 Connector Layout Bus 3.2.1.1 S-DIAS Interface Connector (S-DIAS Adapter Module => X-DIAS Module) Signal Description +24 V bus +24 V bus S-DIAS bus signals +5V S-DIAS +5V S-DIAS RxD- IN Reserve S-DIAS RxD+ IN TxD- OUT TxD+ OUT 3.2.1.2 S-DIAS Interface Connector (X-DIAS Module =>... -
Page 20: X-Dias Connector
X-DIAS DESIGNGUIDE 3.2.1.3 X-DIAS Connector Signal Description +24 V bus +24 V bus S-DIAS bus signals RxD- OUT RxD- IN RxD+ OUT RxD+ IN TxD- IN TxD- OUT TxD+ IN TxD+ OUT I/O signals: modul- specific connector layout Page 18... -
Page 21: Bus Routing
3.2.3 +24 V Bus Supply The X-DIAS modules are supplied with +24 V bus via the S-DIAS bus. If an X-DIAS module requires a +24 V I/O supply, this must be provided separately. Supplying the I/O side of the X- DIAS modules with +24 V bus is not permitted. -
Page 22: S-Dias Bus Supply
DESIGNGUIDE 3.2.4 +5 V S-DIAS Bus Supply Compared to the S-DIAS modules, the X-DIAS modules do not require a 5 V S-DIAS bus supply. If the S-DIAS bus is continued on the last X-DIAS module to connect further S-DIAS modules, the S-DIAS-specific +5 V supply must also be routed from the incoming S-DIAS interface connector to the outgoing S-DIAS interface connector via the wiring board. -
Page 23: Routing I/O Area
The I/O supply of the X-DIAS modules must be provided by a +24 V SELV/PELV power supply unit. The pin assignment for the +24 V I/O supply of the X-DIAS modules can be found in the respective module documentation. The maximum possible current load must be taken into account when dimensioning the conductor track thicknesses or areas for the +24 V I/O supply. -
Page 24: Gnd Concept
X-DIAS DESIGNGUIDE 3.4 GND Concept It is recommended to design the GND on the wiring board as a surface on one layer of the multi-layer board. As the bus and the I/O area are not electrically isolated from each other, a common GND area should be created for both areas. -
Page 25: Example 4-Layer Circuit Board (Multilayer)
DESIGNGUIDE X-DIAS 3.5.1 Example 4-layer circuit board (multilayer) 3.5.1.1 Top Layer It is recommended to use the top layer as the surface for the GND. This embeds the bus on inner layer 1 and the signal lines on inner layers 1 & 2 in GND in order to improve the susceptibility to EMC interference. - Page 26 X-DIAS DESIGNGUIDE 3.5.1.2 Inner Layer 1 It is recommended to use inner layer 1 as the routing layer for the bus. Inner layer 1 is also used to unbundle the signal lines in the I/O area. Furthermore, it is recommended to route sensitive analog signals on inner layer 1 in order to make the best possible use of the TOP layer with GND as a reference layer and shield.
- Page 27 DESIGNGUIDE X-DIAS 3.5.1.3 Inner Layer 2 In areas where no cables run or areas not used for routing should still be filled (flooded) with copper. These copper surfaces are connected to ground potential (0 V). It is recommended to flood the inner layer 2 in the bus area with GND so that the BUS is completely embedded in GND.
- Page 28 X-DIAS DESIGNGUIDE 3.5.1.4 Bottom Layer It is recommended to use the bottom layer for the +24 V I/O supply of the modules. Unused areas for the +24 V I/O supply should be flooded with GND. 3.5.1.5 Further Layers Additional inner layers can be added if required for signal routing. Unused areas for routing should be flooded with GND.
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Page 29: Change History
Changed graphic S-DIAS bus S-DIAS connector on the right-hand side rotated by 180° (second diagram) 3.2.1 Connector Layout Bus Interface connector X-DIAS => S- DIAS rotated by 180° and table adapted accordingly 3.5.1 Example 4-layer circuit board Graphics changed (multilayer) 17.10.2024...
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