AN193 GD32G5xx Hardware Development Guide Table of Contents Table of Contents ......................2 List of Figures ........................ 4 List of Tables ........................5 1. Introduction ......................6 2. Hardware design ...................... 7 2.1. Power supply ....................... 7 2.1.1. Backup domain ........................7 2.1.2.
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AN193 GD32G5xx Hardware Development Guide 5. Revision history ..................... 38...
AN193 GD32G5xx Hardware Development Guide List of Figures Figure 2-1. GD32G5xx series Power supply overview ................. 7 Figure 2-2. VREF Connection ......................... 10 Figure 2-3. GD32G5xx Recommended Power Supply Design..............10 Figure 2-4. Waveform of the POR/PDR ......................11 Figure 2-5. Waveform of the BOR ........................12 Figure 2-6.
AN193 GD32G5xx Hardware Development Guide Introduction This document is specifically designed for developers of the 32-bit general-purpose MCU GD32G5xx series based on the Arm ® Cortex ® -M33 architecture, providing an overall introduction to the hardware development of the GD32G5xx series products, such as power supply, reset, clock, boot mode settings, and download debugging.
AN193 GD32G5xx Hardware Development Guide Hardware design Power supply 2.1. The operating voltage range for V in the GD32G5xx series is 1.71 V to 3.6 V. As shown in Figure 2-1. GD32G5xx series Power supply overview, the GD32G5xx series devices have three power domains, including the V domain, the 1.1 V domain, and the backup domain.
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AN193 GD32G5xx Hardware Development Guide PC13 to PC15. In order to ensure the content of the Backup domain registers and the RTC supply, when V supply is shut down, VBAT pin can be connected to an optional standby voltage supplied by a battery or by another source. The power switch is controlled by the power down reset circuit in the V domain.
AN193 GD32G5xx Hardware Development Guide domain 2.1.2. DD / The V power domain includes two parts: V domain and V domain. If V is not equal to V , the voltage difference between the two should not exceed 300mV (the internal and V of the chip are connected through a back-to-back diode).
AN193 GD32G5xx Hardware Development Guide Figure 2-2. VREF Connection Connect to the VREFP external circuit VREF 0.1uF/ 1uF+10nF Power supply design 2.1.4. The system needs a stable power supply. There are some important things to pay attention to when developing and using: ◼...
AN193 GD32G5xx Hardware Development Guide Note: 1、 All decoupling capacitors must be placed close to the corresponding VDD, VDDA, VBAT, VREFP pins of the chip. 2、 When the MCU power supply voltage is unstable or there is a risk of voltage drop, it is recommended to adjust the 4.7uF capacitor not less than 10uF.
AN193 GD32G5xx Hardware Development Guide bits in option bytes. Notice that the POR/PDR circuit is always implemented regardless of BOR_TH bits in option bytes is 0b11 or not. shows the Figure 2-5. Waveform of the BOR relationship between the supply voltage and the BOR reset signal. V , which defined in the BOR_TH bits in option bytes, indicates the threshold of BOR on reset.The Vhyst is 100mV.
AN193 GD32G5xx Hardware Development Guide Figure 2-6. Waveform of the LVD threshold threshold hyst LVD output The MCU reset source can be searched by the register RCU_RSTSCK. This register can only clear the flag bit after power-on reset. Therefore, during use, after the reset source is obtained, the reset flag can be cleared through the RSTFC control bit, so that a watchdog reset or other reset events can be more accurately reflected in the RCU_RSTSCK register: Figure 2-7.
AN193 GD32G5xx Hardware Development Guide Figure 2-9. Recommend External Reset Circuit External reset circuit 10 kΩ NRST 100 nF GD32G5xx Note: Internal pull-up resistance R = 40 kΩ. You are advised to use an external pull-up resistance of 10 kΩ to ensure that voltage interference does not cause chip abnormalities. If the influence of static electricity is considered, an ESD protection diode can be placed at the NRST pin.
AN193 GD32G5xx Hardware Development Guide HXTAL can also use a bypass input mode to input a clock source (such as a 1 – 48 MHz Figure 2-12. HXTAL External Clock active crystal oscillator). The details are shown in Circuit. When bypassing to an external circuit, the signal is connected to the OSC_IN pin, and the OSC_OUT pin is left floating.
AN193 GD32G5xx Hardware Development Guide The traces connecting the resonator to the MCU clock pins may cause inconsistent lengths of the traces connected to the OSCOUT and OSCIN pins due to the space constraints of the PCB layout. This will make the stray capacitances introduced by the two PCB traces inconsistent, so that the load capacitances on both sides of the resonator cannot be equal in value, and there needs to be a difference to match the actual PCB board.
AN193 GD32G5xx Hardware Development Guide remains floating. For the size of the external matching capacitor, please refer to the formula: C 2*(C ), where C is the stray capacitance of the PCB and MCU pins, the empirical LOAD value is between 2pF ~ 7pF, and 5pF is recommended as a reference value calculation. When it is recommended to use an external crystal, try to choose a crystal load capacitance of about 10pF, so that the externally connected matching capacitors C can be 10pF, and the PCB layout should be as close to the crystal pin as possible.
AN193 GD32G5xx Hardware Development Guide The CK_LXTAL and CK_IRC32K clock signals also can be output on LSCK_OUT pin, even in Deepsleep mode and Standby mode,which seleted by LSCKOUTSEL in the backup Table 2-3. Low-speed domain control register (RCU_BDCTL). The details are shown in clock output source select Table 2-3.
AN193 GD32G5xx Hardware Development Guide Table 2-4. Boot modes Boot mode configuration Selected nBOOT1 BOOT0 nSWBT0 boot area BOOTLK nBOOT0 bit Main Flash memory Main Flash memory Main Flash memory System memory System memory Embedded SRAM0 Embedded SRAM0 ® ® After power-on sequence or a system reset, the Arm Cortex -M33 processor fetches the...
AN193 GD32G5xx Hardware Development Guide Note: After the MCU is running, if the BOOT state is changed, it will take effect after the system is reset. MCU. Typical Peripheral Modules 2.4. GPIO Circuit 2.4.1. GD32G5xx can support up to 107 universal I/O pins(GPIO) ,including PA0 ~ PA15,PB0 ~ PB15,PC0 ~ PC15,PD0 ~ PD15,PE0 ~ PE15,PF0 ~ PF15,PG0 ~ PG10.Each on-chip device uses it to implement logical input / output functions.
AN193 GD32G5xx Hardware Development Guide The same label PIN in multiple groups can only configure one port as an external interrupt. For example, PA0, PB0, and PC0 only support one of the three IO ports to generate external interrupts, and do not support three external interrupt modes. Non-5V tolerance I/O, external voltage over V , may generate perfusion current.
AN193 GD32G5xx Hardware Development Guide relationship between input impedance and sampling period is as shown in Table 2-5. Relationship between Sampling Period and External Input Impedance at fADC = 40MHz. Table 2-5. Relationship between Sampling Period and External Input Impedance at f = 40MHz.
AN193 GD32G5xx Hardware Development Guide value at 25° C, the typical value please refer to the datasheet. temperature Avg_Slope: Average Slope for curve between Temperature vs. V , the typical temperature value please refer to the datasheet. Using high-precision temperature sensors: 1.
AN193 GD32G5xx Hardware Development Guide The DAC conversion can be triggered by software or rising edge of external trigger source. The DAC external trigger is enabled by setting the DTENx bits in the DAC_CTL0 register. The DAC external triggers are selected by the DTSELx bits in the DAC_CTL0 register, which is shown as Table 2-6.
AN193 GD32G5xx Hardware Development Guide These I / Os must be configured in analog mode in the GPIOs registers before they are selected as CMP inputs, Table 2-7. CMP inputs and outputs summary details the inputs and outputs of the CMP. Table 2-7.
AN193 GD32G5xx Hardware Development Guide CMP0 CMP1 CMP2 CMP3 CMP4 CMP5 CMP6 CMP7 CMP outputs BREAK0(TIMER0, TIMER7, TIMER14, TIMER15, TIMER16, TIMER19) connected to internal BREAK1(TIMER0, TIMER7, TIMER19) signals In order to avoid spurious output transitions that caused by the noise signal, a programmable hysteresis is designed to force the hysteresis value by configuring CMPx_CS register.
AN193 GD32G5xx Hardware Development Guide For more detailed information on the functions and usage of the CMP peripheral, please refer to the《GD32G533_553_User_Manual》、《AN198 CMP usage in GD32G5 Series》. HRTIMER 2.4.6. HRTIMER has a high-resolution counting clock(Master_TIMER,Slave_TIMERx (x=0..7)) and can be used for high-precision timing. It can generate 16 high resolution and flexible digital signals to control motor or be used for power management applications.
AN193 GD32G5xx Hardware Development Guide The immediately update mode of HRTIMER is available for compare 0 reset event and compare 2 reset event, and this mode is enabled by setting IMUPDxV bit in HRTIMER_STxCTL1 register. The output PWM waveform is updated immediately without waiting for the end of the current period when the immediate update mode is enabled.
AN193 GD32G5xx Hardware Development Guide Figure 2-22. Recommend Standby external wake-up pin circuit design PC13 Wakeup 10 kΩ Note: In this mode, attention should be paid to the circuit design. If there is a series resistance between the WKUP pin and V , additional power consumption may be added.
AN193 GD32G5xx Hardware Development Guide PCB Layout Design In order to enhance the functional stability and EMC performance of the MCU, it is not only necessary to consider the performance of the supporting peripheral components, but also the PCB Layout. In addition, when conditions permit, try to choose a PCB design solution with an independent GND layer and an independent power supply layer, which can provide better EMC performance.
AN193 GD32G5xx Hardware Development Guide Figure 3-2. Recommend Clock Pin Layout Design (passive crystal) Note: The crystal should be as close to the MCU clock pin as possible, and the matching capacitor should be as close as possible to the crystal. The whole circuit should be on the same layer as the MCU, and the wiring should not go through the layer as much as possible.
AN193 GD32G5xx Hardware Development Guide Note: The resistance and capacitance of the reset circuit should be as close as possible to the NRST pin of the MCU, and the NRST trace should be kept away from devices with strong interference risk and high-speed traces as far as possible. If conditions permit, it had better to wrap the NRST traces for better shielding effect.
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