Cypress Semiconductor CY7C2563KV18 Configurations

72-mbit qdr-ii+ sram 4-word burst architecture (2.5 cycle read latency) with odt

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Features
Separate independent read and write data ports
Supports concurrent transactions
550 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write
ports (data transferred at 1100 MHz) at 550 MHz
Available in 2.5 clock cycle latency
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Data valid pin (QVLD) to indicate valid data on the output
On-Die Termination (ODT) feature
Supported for D
, BWS
[x:0]
Single multiplexed address input bus latches address inputs
for read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR™-II+ operates with 2.5 cycle read latency when DOFF is
asserted HIGH
Operates similar to QDR-I device with 1 cycle read latency
when DOFF is asserted LOW
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core V
= 1.8V± 0.1V; IO V
DD
Supports both 1.5V and 1.8V IO supply
HSTL inputs and variable drive HSTL output buffers
Available in 165-Ball FBGA package (13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
JTAG 1149.1 compatible test access port
Phase Locked Loop (PLL) for accurate data placement
Table 1. Selection Guide
Description
Maximum Operating Frequency
Maximum Operating Current
Note
1. The Cypress QDR-II+ devices surpass the QDR consortium specification and can support V
Cypress Semiconductor Corporation
Document Number: 001-15887 Rev. *E
PRELIMINARY
Architecture (2.5 Cycle Read Latency) with ODT
, and K/K inputs
[x:0]
[1]
= 1.4V to V
DDQ
DD
x8
x9
x18
x36
198 Champion Court
CY7C2561KV18, CY7C2576KV18
CY7C2563KV18, CY7C2565KV18
72-Mbit QDR™-II+ SRAM 4-Word Burst
Configurations
With Read Cycle Latency of 2.5 cycles:
CY7C2561KV18 – 8M x 8
CY7C2576KV18 – 8M x 9
CY7C2563KV18 – 4M x 18
CY7C2565KV18 – 2M x 36

Functional Description

The CY7C2561KV18, CY7C2576KV18, CY7C2563KV18, and
CY7C2565KV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR-II+ architecture. Similar to QDR-II archi-
tecture, QDR-II+ architecture consists of two separate ports: the
read port and the write port to access the memory array. The
read port has dedicated data outputs to support read operations
and the write port has dedicated data inputs to support write
operations. QDR-II+ architecture has separate data inputs and
data outputs to completely eliminate the need to "turn-around"
the data bus that exists with common IO devices. Each port is
accessed through a common address bus. Addresses for read
and write addresses are latched on alternate rising edges of the
input (K) clock. Accesses to the QDR-II+ read and write ports are
completely independent of one another. To maximize data
throughput, both read and write ports are equipped with DDR
interfaces. Each address location is associated with four 8-bit
words (CY7C2561KV18), 9-bit words (CY7C2576KV18), 18-bit
words (CY7C2563KV18), or 36-bit words (CY7C2565KV18) that
burst sequentially into or out of the device. Because data is trans-
ferred into and out of the device on every rising edge of both input
clocks (K and K), memory bandwidth is maximized while simpli-
fying system design by eliminating bus "turn-arounds".
These devices have an On-Die Termination feature supported
for D
, BWS
, and K/K inputs, which helps eliminate
[x:0]
[x:0]
external termination resistors, reduce cost, reduce board area,
and simplify board routing.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the K or K input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
550 MHz
500 MHz
550
500
900
830
900
830
920
850
1310
1210
= 1.4V to V
DDQ
DD
,
San Jose
450 MHz
400 MHz
450
400
760
690
760
690
780
710
1100
1000
.
CA 95134-1709
408-943-2600
Revised April 24, 2009
Unit
MHz
mA
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Summary of Contents for Cypress Semiconductor CY7C2563KV18

  • Page 1: Functional Description

    Each address location is associated with four 8-bit words (CY7C2561KV18), 9-bit words (CY7C2576KV18), 18-bit words (CY7C2563KV18), or 36-bit words (CY7C2565KV18) that burst sequentially into or out of the device. Because data is trans- ferred into and out of the device on every rising edge of both input clocks (K and K), memory bandwidth is maximized while simpli- fying system design by eliminating bus “turn-arounds”.
  • Page 2 [1:0] Logic Block Diagram (CY7C2576KV18) [8:0] Address (20:0) Register Gen. DOFF Control Logic Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Write Write Write Write Read Data Reg. Reg. Reg. Write Write Write Write Read Data Reg. Reg.
  • Page 3 Logic Block Diagram (CY7C2563KV18) [17:0] Address (19:0) Register Gen. DOFF Control Logic [1:0] Logic Block Diagram (CY7C2565KV18) [35:0] Address (18:0) Register Gen. DOFF Control Logic [3:0] Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Write Write Write Write Read Data Reg.
  • Page 4: Pin Configuration

    Pin Configuration The pin configuration for CY7C2561KV18, CY7C2576KV18, CY7C2563KV18, and CY7C2565KV18 follow. 165-Ball FBGA (13 x 15 x 1.4 mm) Pinout DOFF DOFF Note 2. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level.
  • Page 5 Pin Configuration The pin configuration for CY7C2561KV18, CY7C2576KV18, CY7C2563KV18, and CY7C2565KV18 follow. 165-Ball FBGA (13 x 15 x 1.4 mm) Pinout NC/144M DOFF NC/288M DOFF Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 CY7C2563KV18 (4M x 18) NC/288M...
  • Page 6 8M x 8 (4 arrays each of 2M x 8) for CY7C2561KV18, 8M x 9 (4 arrays each of 2M x 9) for CY7C2576KV18, 4M x 18 (4 arrays each of 1M x 18) for CY7C2563KV18 and 2M x 36 (4 arrays each of 512K x 36) for CY7C2565KV18.
  • Page 7 Ground for the Device. Power Supply Power Supply Inputs for the Outputs of the Device. Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Pin Description . All accesses are initiated on the rising edge of K. [x:0] [x:0] output impedance are set to 0.2 x RQ, where RQ is a resistor connected...
  • Page 8: Functional Overview

    CY7C2561KV18, four 9-bit data transfers in the case of CY7C2576KV18, four 18-bit data transfers in the case of CY7C2563KV18, and four 36-bit data transfers in the case of CY7C2565KV18, in two clock cycles. These devices operate with a read latency of two and half cycles when DOFF pin is tied HIGH.
  • Page 9 Depth Expansion The CY7C2563KV18 has a port select input for each port. This enables for easy depth expansion. Both port selects are sampled on the rising edge of the positive input clock only (K). Each port select input can deselect the specified port.
  • Page 10: Application Example

    (CPU or ASIC) CLKIN1/CLKIN1 CLKIN2/CLKIN2 Source K Source K Table 3. Truth Table The truth table for CY7C2561KV18, CY7C2576KV18, CY7C2563KV18, and CY7C2565KV18 follows. Operation RPS WPS [10] Write Cycle: Load address on the rising edge of K; input write data on two consecutive K and K rising edges.
  • Page 11 Table 4. Write Cycle Descriptions The write cycle description table for CY7C2561KV18 and CY7C2563KV18 follows. L–H – During the data portion of a write sequence: CY7C2561KV18 − both nibbles (D CY7C2563KV18 − both bytes (D – L-H During the data portion of a write sequence: CY7C2561KV18 −...
  • Page 12 L–H – Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 [4, 12] – During the data portion of a write sequence, all four bytes (D the device. L–H During the data portion of a write sequence, all four bytes (D the device.
  • Page 13 TDO pin on the falling edge of TCK. Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Instruction Register Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO pins, as shown in page 16.
  • Page 14 TDI and TDO pins. Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 PRELOAD places an initial data pattern at the latched parallel outputs of the boundary scan register cells before the selection of another boundary scan test operation.
  • Page 15 IDLE Note 13. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Figure 2. TAP Controller State Diagram SELECT DR-SCAN CAPTURE-DR SHIFT-DR...
  • Page 16 (AC) < V + 0.35V (Pulse width less than t 16. All Voltage referenced to Ground. Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Figure 3. TAP Controller Block Diagram Bypass Register Instruction Register Identification Register Boundary Scan Register...
  • Page 17 18. Test conditions are specified using the load in TAP AC Test Conditions. t Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Description [18] Figure 4. TAP Timing and Test Conditions 1.8V 50Ω...
  • Page 18 Do Not Use: This instruction is reserved for future use. BYPASS Places the bypass register between TDI and TDO. This operation does not affect SRAM operation. Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Value CY7C2576KV18 CY7C2563KV18 00000110100 00000110100 Description...
  • Page 19 Table 10. Boundary Scan Order Bit # Bump ID Bit # Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Bump ID Bit # Bump ID Bit # Bump ID Internal Page 19 of 29 [+] Feedback...
  • Page 20 Clock Start (Clock Starts after DOFF Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 PLL Constraints PLL uses K clock as its synchronizing input. The input must ■ have low phase jitter, which is specified as t The PLL functions at frequencies down to 120 MHz.
  • Page 21: Maximum Ratings

    23. The operation current is calculated with 50% read cycle and 50% write cycle. Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Current into Outputs (LOW) ... 20 mA Static Discharge Voltage (MIL-STD-883, M. 3015).. > 2001V Latch-up Current ... > 200 mA...
  • Page 22: Thermal Resistance

    Description Θ Thermal Resistance (Junction to Ambient) Θ Thermal Resistance (Junction to Case) Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Test Conditions Max V 550 MHz (x8) Both Ports Deselected, (x9) ≥ V ≤ V or V...
  • Page 23 24. Unless otherwise noted, test conditions are based on signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, V pulse levels of 0.25V to 1.25V, and output loading of the specified I Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 = 0.75V 0.75V R = 50Ω OUTPUT Device 0.25V...
  • Page 24: Switching Characteristics

    QVLD signal. QVLD 31. Hold to >V or <V Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 550 MHz Description Min Max Min Max Min Max Min Max [26] 1.81 0.77 0.23...
  • Page 25: Switching Waveforms

    34. In this example, if address A2 = A1, then data Q20 = D10, Q21 = D11, Q22 = D12, and Q23 = D13. Write data is forwarded immediately as read results. This note applies to the whole diagram. Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 WRITE READ WRITE t KHKH...
  • Page 26: Ordering Information

    CY7C2576KV18-500BZXI CY7C2563KV18-500BZXI CY7C2565KV18-500BZXI Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 http://www.cypress.com/products Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 27 CY7C2563KV18-400BZXI CY7C2565KV18-400BZXI Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 Package Diagram Package Type 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Pb-Free 51-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
  • Page 28: Package Diagram

    Figure 7. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180 TOP VIEW PIN 1 CORNER 13.00±0.10 SEATING PLANE Document Number: 001-15887 Rev. *E CY7C2561KV18, CY7C2576KV18 PRELIMINARY CY7C2563KV18, CY7C2565KV18 0.15(4X) BOTTOM VIEW PIN 1 CORNER Ø0.05 M C Ø0.25 M C A B -0.06 Ø0.50 (165X) +0.14...
  • Page 29 Document History Page Document Title: CY7C2561KV18/CY7C2576KV18/CY7C2563KV18/CY7C2565KV18, 72-Mbit QDR™-II+ SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency) with ODT Document Number: 001-15887 Orig. Of Submission Rev. Ecn No. Change Date 1120252 See ECN 1246904 VKN/AESA See ECN 1739343 VKN/AESA See ECN...

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