3.5" sbc supports 14nm 8th gen. intel core i7/i5/i3 or celeron on-board processor ult, 15w with ddr4 so-dimm, triple display by dual hdmi & lvds, m.2 a-key, pcie mini with msata, usb 3.2 gen 2 10gb/s, sata 6gb/s, dual com, audio and rohs (14 pages)
3.5" sbc with rockchip rk3588 processors, 8gb lpddr4x memory, 32gb emmc nand flash, single hdmi input and dual hdmi output, 2.5gbe lan, gbe lan, usb 3.2 gen 1, usb 2.0, 0 c 60 c and rohs (66 pages)
3.5" sbc supports 10nm 11th gen intel core i7/i5/i3 and celeron on-board soc with hdmi, dp, idpm, triple 2.5gbe lan, m.2, com, sata 6gb/s, usb 3.2 gen 2, iaudio, (16 pages)
Summary of Contents for IEI Technology WAFER-IMX8MP Series
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WAFER-IMX8MP SBC WAFER-IMX8MP CPU Card MODEL: WAFER-IMX8MP 3.5" SBC with NXP i.MX 8M Plus Processor, 4GB LPDDR4, 16GB eMMC Flash, Dual Display via HDMI & MIPI DSI, MIPI CSI, GPIO, Dual GbE, USB Type-C, RS-232/422/485, Android 12 / Yocto 3.2 / Ubuntu 22.04, 0°C ~70°C and RoHS User Manual Page I Rev.
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WAFER-IMX8MP SBC Revision Date Version Changes September 8, 2023 1.00 Initial release Page II [MODEL NAME]...
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WAFER-IMX8MP SBC Copyright COPYRIGHT NOTICE The information in this document is subject to change without prior notice in order to improve reliability, design and function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages.
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WAFER-IMX8MP SBC Manual Conventions WARNING Warnings appear where overlooked details may cause damage to the equipment or result in personal injury. Warnings should be taken seriously. CAUTION Cautionary messages should be heeded to help reduce the chance of losing data or damaging the product. NOTE These messages inform the reader of essential but non-critical information.
WAFER-IMX8MP SBC Table of Contents 1 INTRODUCTION ......................1 1.1 I ......................2 NTRODUCTION 1.2 M ....................3 ODEL ARIATIONS 1.3 F ........................3 EATURES 1.4 C ......................4 ONNECTORS 1.5 D ....................... 5 IMENSIONS 1.6 D ........................ 6 1.7 T ..................
1.1 Introduction Figure 1-1: WAFER-IMX8MP The WAFER-IMX8MP series is a 3.5" form factor single bard computer. It has an on-board NXP i.MX 8M Plus which is an Arm® Cortex® -A53 quad-core processor with a Neural Processing Unit (NPU) operating at up to 2.3 TOPS. It is also pre-installed with 4 GB 3200 MHz LPDDR4 memory, and 16 GB eMMC NAND flash.
WAFER-IMX8MP SBC 1.2 Model Variations The model variations of the WAFER-IMX8MP series are listed below. Model No. Processor NXP i.MX 8M Plus Android 12 WAFER-IMX8MP-A/BD NXP i.MX 8M Plus Yocto 3.2 WAFER-IMX8MP-Y/BD NXP i.MX 8M Plus Ubuntu 22.04 WAFER-IMX8MP-U/BD Table 1-1: WAFER-IMX8MP Model Variations 1.3 Features...
WAFER-IMX8MP SBC 1.6 Data Flow Figure 1-4 shows the data flow between the system chipset, the CPU and other components installed on the motherboard. Figure 1-4: Data Flow Diagram Page 6...
WAFER-IMX8MP SBC 1.7 Technical Specifications WAFER-IMX8MP technical specifications are listed below. Specification WAFER-IMX8MP Processor NXP i.MX 8M Plus Quad (quad-core Cortex®-A53 up to 1.8 GHz) GC7000UL 3D (2 shaders), GC520L Up to 2.3 TOPS 4 GB LPDDR4-3200, up to 8GB Flash 16 GB eMMC NAND flash, up to 128GB 1 x microSD slot...
WAFER-IMX8MP SBC 2.1 Anti-static Precautions WARNING! Static electricity can destroy certain electronics. Make sure to follow the ESD precautions to prevent damage to the product, and injury to the user. Make sure to adhere to the following guidelines: Wear an anti-static wristband: Wearing an anti-static wristband can prevent electrostatic discharge.
WAFER-IMX8MP SBC 2.3 Packing List NOTE: If any of the components listed in the checklist below are missing, do not proceed with the installation. Contact the IEI reseller or vendor the WAFER-IMX8MP was purchased from or contact an IEI sales representative directly by sending an email to sales@ieiworld.com.
WAFER-IMX8MP SBC 2.4 Optional Items The following are optional components which may be separately purchased: Item and Part Number Image 10.1" color TFT-LCD with projected capacitive touch (800x1280, 340 cd/m , LED, RoHS) (P/N : 23T00-01010AW01-RS) Camera module (2592x1944, 1/4", 8.5x14.5x5.45mm, sensor type: OV5640, RoHS) (P/N: 7I001-COD631A5SFE-RS) Speakers with cables (Speakers: 36.6x14x10.4mm, 8Ω,...
WAFER-IMX8MP SBC 3.1 Peripheral Interface Connectors This chapter details all the jumpers and connectors. 3.1.1 WAFER-IMX8MP Layout The figures below show all the connectors and jumpers. Figure 3-1: Connector and Jumper Locations Page 15...
WAFER-IMX8MP SBC 3.1.3 External Interface Panel Connectors The table below lists the connectors on the external I/O panel. Connector Type Label Audio earphone jack Audio jack DC power input connector 2-pin terminal block CN26 HDMI output connector HDMI LAN connectors RJ-45 CN19, CN20 LED indicators...
WAFER-IMX8MP SBC 3.2 Internal Peripheral Connectors The section describes all of the connectors on the WAFER-IMX8MP. 3.2.1 Debug Port Connector CN Label: CN16 CN Type: 4-pin wafer, p=1.25mm CN Location: See Figure 3-2 CN Pinouts: See Table 3-3 The connector is used to debug. Figure 3-2: Debug Port Connector Location Description DEBUG_TX...
WAFER-IMX8MP SBC 3.2.2 Download Key CN Label: CN Type: On-board tact button CN Location: See Figure 3-3 The download key allows users to access the service mode for software update. Long-press the download key to boot the system into the service mode. Figure 3-3: Download Key Location 3.2.3 External GPIO Connector CN Label:...
WAFER-IMX8MP SBC 3.2.7 MIPI CSI Connector CN Label: CN18 CN Type: 30-pin FPC, p=0.5 mm CN Location: See Figure 3-8 CN Pinouts: See Table 3-7 The MIPI CSI connector is used to connect to a camera module. Figure 3-8: MIPI CSI Connector Location Description Description CAM_LED-...
WAFER-IMX8MP SBC 3.2.8 SIM Slot CN Label: U117 CN Type: Mini SIM slot, push-to-push CN Location: See Figure 3-9 CN Pinouts: See Table 3-8 The SIM card slot accepts a SIM card for LTE network communication. NOTE: A LTE module must be installed in the LTE module slot (J6) to provide WWAN communication.
WAFER-IMX8MP SBC 3.2.13 USB Type-C Connector CN Label: CN23 CN Type: USB Type-C CN Location: F igure 3-14 8 1 4 H CN Pinouts: Table 3-12 8 1 5 H The WAFER-IMX8MP has one USB Type-C port. The pinouts are shown below. Figure 3-14: USB Type-C Port Location Description Description...
WAFER-IMX8MP SBC 3.3.4 LAN Connectors CN Label: CN19, CN20 CN Type: RJ-45 CN Location: F igure 3-16 8 0 8 H CN Pinouts: F igure 3-20 and Table 3-16 8 0 9 H The GbE LAN connector connects to a local network. Description Description MDIA0+...
WAFER-IMX8MP SBC 3.3.5 LED Indicators CN Label: CN Type: CN Location: See Figure 3-16 The behaviors of the LED indicators are shown below. Status Description Green Power connected No power connected Turned on and boot into OS Not turned on / Failed to boot into OS Figure 3-21: LED Indicators Page 35...
WAFER-IMX8MP SBC 3.3.6 RS-232/422/485 Serial Port Connector CN Label: CN25 CN Type: DB-9 connector CN Location: See Figure 3-16 CN Pinouts: See Table 3-18 and Figure 3-22 The pinouts for RS-232, RS-422 and RS-485 communication are shown below. The default mode is set to RS-232. Users can use software or app to configure the connector as RS-422 or RS-485.
WAFER-IMX8MP SBC 3.3.7 USB 5Gb/s Connectors CN Label: CN21 CN Type: USB Type-A CN Location: F igure 3-16 8 1 4 H CN Pinouts: Table 3-19 and Figure 3-23 8 1 5 H The WAFER-IMX8MP has two external USB 5Gb/s ports. The USB connector can be connected to a USB 2.0 or USB 5Gb/s device.
WAFER-IMX8MP SBC 4.1 Anti-static Precautions WARNING: Failure to take ESD precautions during the installation of the WAFER-IMX8MP result permanent damage WAFER-IMX8MP and severe injury to the user. Electrostatic discharge (ESD) can cause serious damage to electronic components, including the WAFER-IMX8MP. Dry climates are especially susceptible to ESD. It is therefore critical that whenever the WAFER-IMX8MP or any other electrical component is handled, the following anti-static precautions are strictly adhered to.
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WAFER-IMX8MP SBC WARNING: The installation instructions described in this manual should be carefully followed in order to prevent damage to the WAFER-IMX8MP, WAFER-IMX8MP components and injury to the user. Before and during the installation please DO the following: Read the user manual: The user manual provides a complete description of the WAFER-IMX8MP installation instructions and configuration options.
WAFER-IMX8MP SBC 4.3 M.2 Module Installation To install an M.2 module, please follow the steps below. Step 1: Locate the M.2 module slot. See Chapter 3. Step 2: Remove the retention screw secured on the motherboard. Step 3: Line up the notch on the module with the notch on the slot. Slide the M.2 module into the socket at an angle of about 20º...
WAFER-IMX8MP SBC 4.4 Chassis Installation 4.4.1 Airflow WARNING: Airflow is critical for keeping components within recommended operating temperatures. The chassis should have fans and vents as necessary to keep things cool. The WAFER-IMX8MP must be installed in a chassis with ventilation holes on the sides allowing airflow to travel through the heat sink surface.
WAFER-IMX8MP SBC 5.1 Available Drivers All the drivers for the WAFER-IMX8MP are available on IEI Resource Download Center (https://download.ieiworld.com). Type WAFER-IMX8MP and press Enter to find all the relevant software, utilities, and documentation. Figure 5-1: IEI Resource Download Center 5.2 Driver Download To download drivers from IEI Resource Download Center, follow the steps below.
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WAFER-IMX8MP SBC Step 3: Click the driver file name on the page and you will be prompted with the following window. You can download the entire ISO file ( ), or click the small arrow to find an individual driver and click the file name to download ( NOTE: To install software from the downloaded ISO image file in Windows 8, 8.1 or 10, double-click the ISO file to mount it as a virtual drive to view...
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WAFER-IMX8MP SBC DECLARATION OF CONFORMITY This equipment has been tested and found to comply with specifications for CE marking. If the user modifies and/or installs other devices in the equipment, the CE conformity declaration may no longer apply. FCC WARNING This equipment complies with Part 15 of the FCC Rules.
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WAFER-IMX8MP SBC CAUTION: Risk of explosion if battery is replaced by an incorrect type. Only certified engineers should replace the on-board battery. Dispose of used batteries according to instructions and local regulations. Outside the European Union–If you wish to dispose of used electrical and electronic products outside the European Union, please contact your local authority so as to comply with the correct disposal method.
WAFER-IMX8MP SBC C.1 RoHS II Directive (2015/863/EU) The details provided in this appendix are to ensure that the product is compliant with the RoHS II Directive (2015/863/EU). The table below acknowledges the presences of small quantities of certain substances in the product, and is applicable to RoHS II Directive (2015/863/EU).
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