Cypress Semiconductor CY7C1024DV33 Specification Sheet

3-mbit (128k x 24) static ram

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Features
High speed
t
= 10 ns
AA
Low active power
I
= 175 mA at 10 ns
CC
Low CMOS standby power
I
= 25 mA
SB2
Operating voltages of 3.3 ± 0.3V
2.0V data retention
Automatic power down when deselected
TTL compatible inputs and outputs
Easy memory expansion with CE
Available in Pb-free standard 119-ball PBGA
Logic Block Diagram
A
Cypress Semiconductor Corporation
Document Number: 001-08353 Rev. *C
, CE
, and CE
features
1
2
3
INPUT BUFFER
128K x 24
ARRAY
(9:0)
COLUMN
DECODER
A
(16:10)
198 Champion Court
3-Mbit (128K X 24) Static RAM

Functional Description

The CY7C1024DV33 is a high performance CMOS static RAM
organized as 128K words by 24 bits. This device has an
automatic power down feature that significantly reduces power
consumption when deselected.
To write to the device, enable the chip (CE
and CE
LOW), while forcing the Write Enable (WE) input LOW.
3
To read from the device, enable the chip by taking CE
HIGH, and CE
LOW while forcing the Output Enable (OE) LOW
3
and the Write Enable (WE) HIGH. See the
7 for a complete description of Read and Write modes.
The 24 I/O pins (I/O
to I/O
0
23
state when the device is deselected (CE
CE
HIGH) or when the output enable (OE) is HIGH during a
3
write operation. (CE
LOW, CE
1
LOW).
CE
, CE
1
WE
CONTROL LOGIC
OE
,
San Jose
CA 95134-1709
CY7C1024DV33
LOW, CE
HIGH,
1
2
LOW, CE
1
Truth Table
on page
) are placed in a high impedance
HIGH, CE
LOW, or
1
2
HIGH, CE
LOW, and WE
2
3
I/O
– I/O
0
23
, CE
2
3
408-943-2600
Revised November 6, 2008
2
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Summary of Contents for Cypress Semiconductor CY7C1024DV33

  • Page 1: Functional Description

    Document Number: 001-08353 Rev. *C 3-Mbit (128K X 24) Static RAM Functional Description The CY7C1024DV33 is a high performance CMOS static RAM organized as 128K words by 24 bits. This device has an automatic power down feature that significantly reduces power consumption when deselected.
  • Page 2: Selection Guide

    Maximum Operating Current Maximum CMOS Standby Current Pin Configuration Note 1. NC pins are not connected on the die. Document Number: 001-08353 Rev. *C Figure 1. 119-Ball PBGA Top View CY7C1024DV33 –10 Unit Page 2 of 9 [+] Feedback [+] Feedback...
  • Page 3: Maximum Ratings

    Still air, soldered on a 3 × 4.5 inch, four layer printed circuit board . CE is LOW when CE , CE are LOW and CE is HIGH. CE is HIGH when CE CY7C1024DV33 ... –0.5V to V + 0.5V Ambient Temperature 3.3V ± 0.3V –40°C to +85°C...
  • Page 4 [3, 7] [3, 7] [3, 8] [3, 8] to the data retention (V , 2.0V) voltage. CCDR values until the first memory access is performed. CY7C1024DV33 R1 317 Ω 3.3V OUTPUT 5 pF* 351Ω Including jig and scope Fall Time:> 1V/ns –10...
  • Page 5 LOW and WE LOW. Chip enables must be active and WE must be LOW to and t HZWE > 50 μs or stable at V > 50 μs. to V CC(min) CC(min) CY7C1024DV33 –10 Unit 3.0V Page 5 of 9 Unit [+] Feedback [+] Feedback...
  • Page 6 16. Data I/O is high impedance if OE = V 17. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high impedance state. Document Number: 001-08353 Rev. *C DATA VALID DATA VALID CY7C1024DV33 [13, 14] DATA VALID [3, 14, 15] HZOE...
  • Page 7: Truth Table

    High Z Power Down High Z Power Down Full Data Out Read Full Data In Write High Z Selected, Outputs Disabled Active (I CY7C1024DV33 [3, 16, 17] [3, 17] LZWE Power Standby (I Standby (I Standby (I Active (I Active (I...
  • Page 8: Ordering Information

    Ordering Information Speed Ordering Code (ns) CY7C1024DV33-10BGXI Package Diagram Document Number: 001-08353 Rev. *C Package Package Type Name 51-85115 119-Ball Plastic Ball Grid Array (14 x 22 x 2.4 mm) (Pb-Free) Figure 8. 119-Ball PBGA (14 x 22 x 2.4 mm)
  • Page 9 Document History Page Document Title: CY7C1024DV33, 3-Mbit (128K X 24) Static RAM Document Number: 001-08353 Orig. of Submission Rev. ECN No. Change Date 469517 See ECN 499604 See ECN 1462586 VKN/SFV See ECN 2604677 VKN/PYRS 11/12/08 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors.

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