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External stresses and loads
Damage to device by severe external stresses and loads (e.g. thermal expansion or pipe
tension). Process media can be released.
• Prevent severe external stresses and loads from acting on the device.
5.2.1
Damage from electrostatic discharge (ESD) - CAUTION note
Damage from electrostatic discharge (ESD)
Some components in the device (such as communication cards, or memory cards) are sensitive
to electrostatic discharge and could be damaged. Be sure to handle such components in a
manner that avoids any potential damage due to ESD.
5.2.2
Installation location requirements
Insufficient air supply
The device may overheat if there is an insufficient supply of air.
• Install the device so that there is sufficient air supply in the room.
• Observe the maximum permissible ambient temperature. Refer to the information in the
NOTICE
Aggressive atmospheres
Damage to device through penetration of aggressive vapors.
• Ensure that the device is suitable for the application.
SITRANS FSS100
Installation Manual, 12/2023, A5E52595000-AA
CAUTION
CAUTION
WARNING
section Technical specifications (Page 77).
Installing/mounting
5.2 Basic safety notes
29
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