Bill of Materials, Printed-Circuit Board Layout, and Schematics
7 Bill of Materials, Printed-Circuit Board Layout, and Schematics
This section contains the ADS8354EVM bill of materials (BOM), printed-circuit board (PCB) layout, and
schematics.
7.1 Bill of Materials
Table 7-1
lists the ADS8354EVM BOM.
Manufacturer Part Number
Quantity
DC196
0603YC104JAT2A
15
06033C105KAT2A
C0603C101J5GACTU
EMK107BB7225MA-T
C1608X5R1E106M080AC
GRM1885C1H821JA01D
C0603C100F5GAC7867
GRM188R61C474KA93D
CGA3E1X7R1E105K080AD
CL21A226KOQNNNE
CL21A475KOFNNNE
CL21B106KOQNNNE
C3216X5R1E476M160AC
GRM1885C1H102FA01J
1N4148WT
APT2012LZGCK
9774050360R
SJ-5303 (CLEAR)
RM3X4MM 2701
5-1814832-2
TSW-106-07-G-D
QTH-030-01-L-D-A
TSW-102-07-G-S
TSW-103-07-G-S
THT-14-423-10
RC0603FR-0720KL
RC0603FR-071K5L
CRCW060315R0FKEA
ERJ-3RQFR22V
RC0603FR-0713RL
ERJ-3GEY0R00V
18
ADS8354EVM-PDK Evaluation Module
Table 7-1. ADS8354EVM Bill of Materials
Reference
Manufacturer
Designators
1
PCB
C1, C3, C4, C5, C6,
KYOCERA AVX
C7, C8, C13, C15,
C16, C17, C28, C31,
C37, C39
1
C2
KYOCERA AVX
4
C9, C10, C11, C12
KEMET
2
C14, C18
Taiyo Yuden
6
C19, C20, C40, C41,
TDK Corporation
C42, C44
2
C21, C23
KEMET
4
C22, C24, C25, C26
KEMET
1
C27
KEMET
3
C29, C30, C38
TDK Corporation
1
C32
Samsung Electro-
Mechanics
2
C33, C34
Samsung Electro-
Mechanics
1
C35
Samsung Electro-
Mechanics
1
C36
TDK Corporation
1
C43
Murata Electronics CAP, CERM, 1000 pF, 50 V, +/- 1%, C0G/NP0, 0603
2
D1, D2
Yangzhou
Yangjie Electronic
Technology Co.,Ltd
1
D3
Kingbright
2
H1, H2
Würth Elektronik
4
H3, H4, H5, H6
3M
2
H10, H11
APM Hexseal
4
J1, J2, J3, J4
TE Connectivity
AMP Connectors
1
J5
Samtec Inc.
1
J6
Samtec Inc.
9
JP1, JP2, JP3, JP4,
Samtec Inc.
JP5, JP6, JP7, JP8,
JP10
1
JP9
Samtec Inc.
1
LBL1
Brady Corporation
4
R1, R2, R3, R4
YAGEO
8
R5, R6, R7, R8, R9,
YAGEO
R10, R11, R12
4
R13, R14, R15, R16
Vishay Dale
2
R17, R18
Panasonic
Electronic
Components
4
R19, R20, R21, R22
YAGEO
2
R23, R41
Panasonic
Electronic
Components
Copyright © 2023 Texas Instruments Incorporated
Description
Printed Circuit Board
CAP, CERM, 0.1 uF, 16 V, +/- 5%, X7R, 0603
CAP, CERM, 1 uF, 25 V, +/- 10%, X7R, 0603
CAP, CERM, 100 pF, 50 V, +/- 5%, C0G/NP0, 0603
CAP, CERM, 2.2 uF, 16 V,+/- 10%, X7R, 0603
CAP, CERM, 10 uF, 25 V, +/- 20%, X5R, 0603
CAP, CERM, 820 pF, 50 V, +/- 5%, C0G/NP0, 0603
CAP, CERM, 10 pF, 50 V, +/- 1%, C0G/NP0, 0603
CAP, CERM, 0.47 uF, 16 V, +/- 10%, X5R, 0603
CAP, CERM, 1 µF, 25 V,+/- 10%, X7R, AEC-Q200 Grade 1, 0603
CAP, CERM, 22 µF, 16 V,+/- 10%, X5R, 0805
CAP, CERM, 4.7 µF, 16 V,+/- 10%, X5R, 0805
CAP, CERM, 10 uF, 16 V, +/- 10%, X7R, 0805
CAP, CERM, 47 uF, 25 V, +/- 20%, X5R, 1206_190
Diode, Switching, 75 V, 0.3 A, SOD-523F
LED, Green, SMD
ROUND STANDOFF M3 STEEL 5MM
Bumpon, Hemisphere, 0.44 X 0.20, Clear
Machine Screw Pan PHILLIPS M3
SMA Straight PCB Socket Die Cast, 50 Ohm, TH
Header, 100mil, 6x2, Gold, TH
Header(Shrouded), 19.7mil, 30x2, Gold, SMT
Header, 100mil, 2x1, Gold, TH
Header, 100mil, 3x1, Gold, TH
Thermal Transfer Printable Labels, 0.650
RES, 20.0 k, 1%, 0.1 W, 0603
RES, 1.50 k, 1%, 0.1 W, 0603
RES, 15.0, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
RES, 0.22, 1%, 0.1 W, AEC-Q200 Grade 0, 0603
RES, 13.0, 1%, 0.1 W, 0603
RES, 0, 5%, 0.1 W, 0603
www.ti.com
SBAU407 – APRIL 2023
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