Seco Smarc CSM-B79 User Manual page 77

4.1 Thermal Design
A parameter that has to be kept in very high consideration is the thermal design of the system.
Highly integrated modules, like SMARC
prevent system hang-off or faults.
®
SMARC specifications take into account the use of a heatspreader, which will act only as thermal coupling device between the SMARC
dissipating surface/cooler. The heatspreader also needs to be thermally coupled to all the heat generating surfaces using a thermal gap pad, which will optimise the
heat exchange between the module and the heatspreader.
The heatspreader is not intended to be a cooling system by itself, but only as means for transferring heat to another surface/cooler, like heatsinks, fans, heat pipes
and so on.
Conversely, heatsinks in some situation can represent a cooling solution. Until the modules are used on a development Carrier board, on free air, just for software
development and
workload of the processor. Heavy computational tasks will generate much heat.
Indeed, when using CSM-B79 carrier board with any SMARC
of utilisation.
Therefore, it is always necessary that the customer study and develop accurately the cooling solution for his syste
scenarios, the enclosures of the system, the air flow and so on. This is particularly needed for industrial grade modules.
®
SECO can provide SMARC
inside the final system (electronics + mechanics), and that they should be used only as a part of a more comprehensive ad-hoc cooling solutions, which also keeps
the surface temperat
grade).
CSM-B79
CSM-B79 User Manual - Rev. First Edition: 1.0 - Last Edition: 1.1 - Author: A.R - Reviewed by S.R. - Copyright © 2021 SECO S.p.A.
® modules, offer to the user very
®
module, it is necessary to consider carefully the global heat generated by the system, and the scenario
ount of heat, that must be dissipated to
passive), but please remember that their use must be evaluated accurately
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module and an external
ends also on the
rial or commercial
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