Mechanical Specifications - Seco CCHPC-C78-C User Manual

Carrier board for com-hpc compliant client modules
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2.4 Mechanical Specifications

According to ATX form factor, board dimensions are nominal 305 x 244 mm (12" x 9.6").
The printed circuit of the board is made of twelve layers, some of them are ground planes, for disturbance rejection.
In order to fix the COM HPC module to the carrier board, on HC78 have been soldered four metallic spacers, height 8mm, 2.5mm diameter.
CCOMe-C79
CCOMe-C79 - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: A.R. - Reviewed by E.S. Copyright © 2021 SECO S.p.A.
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