Pad Assignment - Holtek HT827A0 Manual

Pad Assignment

1 4 4
P B 3 2
P B 2 3
4
P B 1
5
P B 0
V S S
6
7
P E 0
8
P E 1
9
P E 2
P E 3
1 0
I N T 1 1
1 2
T M R
1 3 1 4 1 5
* The IC substrate should be connected to VSS in the PCB layout artwork.
* The TMR pad must be bound to VDD or VSS if it is not used.
4 3 4 2 4 0 3 9 3 8
4 1
( 0 , 0 )
1 8 1 9
1 6 1 7 2 0 2 1 2 2 2 3 2 4
Chip size: 3555 ´ 5015 (mm)
3
3 7 3 6 3 5
3 4
3 3
O S C 2
3 2
O S C 1
3 1
V D D
3 0
R E S
2 9 A U D
2 5 2 6 2 7 2 8
2
March 15, 2000
HT827A0