Cooling; Esd Prevention - H3C WX2880X Installation Manual

Substance
Dust particle diameter ≥ 5 µm
To eliminate corrosion and premature aging of components, the equipment room must also meet
limits on salts, acids, and sulfides, as shown in Table1-3.
Table1-3 Harmful gas limits in an equipment room
Gas
SO
2
H S
2
NH
3
Cl
2
NO
2

Cooling

The device intakes air from side panels, and exhausts air from the rear panels. For adequate heat
dissipation of the device, follow these guidelines:
•
Plan the installation site for the device based on the airflow direction
•
Reserve a minimum clearance of 100 mm (3.94 in) around the air vents.
•
Make sure the rack or workbench has a good ventilation system.
Figure1-1 Heat dissipation

ESD prevention

On the communication network, ESD comes from the following sources:
•
External electric field such as outdoor high-voltage power lines and thunder and lightning.
•
Indoor environment, floor materials, device materials, and device components.
To prevent electrostatic discharge (ESD), follow these guidelines:
•
Ground the device reliably.
•
Take dust-proof measures for the equipment room. For more information, see "Cleanliness."
•
Maintain the humidity and temperature at acceptable levels. For more information, see
"Temperature and
Concentration limit (particles/m
Max. (mg/m
0.2
0.006
0.05
0.01
0.04
humidity."
1-3
3
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3
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