Cooling; Esd Prevention; Emi - H3C WX2540E Installation Manual

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Table 2 Dust concentration limit in the equipment room
Substance
Dust particles
NOTE:
Dust particle diameter ≥ 5 µm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 3 Harmful gas limits in the equipment room
Gas
SO
2
H
S
2
NH
3
Cl
2

Cooling

Leave a minimum of 10 cm (3.94 in) of clearance around the device.
A good ventilation system is available at the installation site.

ESD prevention

The device might be damaged by the following Electrostatic discharge (ESD) sources:
Outdoor environment—For example, high-voltage power line and lightning.
Indoor environment—For example, floor carpet.
Device internal system.
To prevent ESD damage, follow these guidelines:
Ground the device reliably.
Take dust-proof measures for the equipment room. For more information, see "Cleanliness."
Maintain the humidity and temperature at acceptable levels. For more information, see
"Temperature and
Wear an ESD suit and an ESD wrist strap, wear ESD gloves, and remove any electrically conducting
objects such as watch or jewelry before handling the device.

EMI

All electromagnetic interference (EMI) sources, from outside or inside of the switch and application
system, adversely affect the switch in the following ways:
Concentration limit (particles/m
≤ 3 x 10
(No visible dust on desk in three days)
Max. (mg/m
0.2
0.006
0.05
0.01
humidity."
3
4
Table
3.
3
)
3
)

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