Cleanliness; Cooling; Esd Prevention - H3C WX1800H Series Installation Manual

Cleanliness

Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table1-2 Dust concentration limit in the equipment room
Substance
Dust particles
NOTE:
Dust particle diameter ≥ 5 µm
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in Table1-3.
Table1-3 Harmful gas limits in the equipment room
Gas
SO
2
H S
2
NH
3
Cl
2
NO
2

Cooling

The device uses left-to-right airflow. For adequate heat dissipation, plan the installation site for the
device based on its airflow direction and make sure the following requirements are met:
•
A minimum clearance of 100 mm (3.94 in) is reserved around the device.
•
The workbench or rack where the device is to be installed has a good ventilation system.
Figure1-1 Airflow through the chassis (WX1840H)

ESD prevention

ESD prevention guidelines
To prevent electrostatic discharge (ESD), follow these guidelines:
•
Make sure the device is reliably grounded.
Concentration limit (particles/m
4
≤ 3 x 10
(No visible dust on desk in three days)
3
Max. (mg/m )
0.2
0.006
0.05
0.01
0.04
1-3
3
)