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7/ Reflow profile
Table 10: Reflow profile
Profile Feature
Average Ramp-Up Rate (T
Preheat
Temperature Min (T
SMIN
Temperature Max (T
SMAX
Time (t
) from (T
to T
s
SMIN
Liquidous temperature (T
Time (t
) maintained above T
L
Peak/Classification Temperature (T
Time within 5 °C of actual peak temperature (t
Ramp-down rate
Time 25 °C to peak temperature
Figure 11: Reflow Classification Profile
To minimize the stress for the components, it is strongly recommended to solder the SoM during the last reflow cycle of
the carrier board manufacturing process.
www.kontron-electronics.de
to T
)
SMAX
P
)
)
)
SMAX
)
L
L
)
P
)
P
Pb-Free Assembly
3°C/second max.
150 °C
200 °C
60-120 seconds
217 °C
60-80 seconds
250 °C
20 seconds
6°C/second max
8 minutes max
SL iMX6UL/ULL - Rev. 0.4
// 29
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