2.5.2 Component placement ....................................................................................................................31
2.7 Thermal guidelines ...................................................................................................................................34
2.8 ESD guidelines ...........................................................................................................................................35
2.9 Design-in checklist ....................................................................................................................................36
2.9.1 Schematic checklist .........................................................................................................................36
2.9.2 Layout checklist ................................................................................................................................36
3
Software ................................................................................................................................................ 37
3.2 Software package content ......................................................................................................................38
3.2.1 Wi-Fi firmware images .....................................................................................................................38
3.3.1 Wi-Fi driver .........................................................................................................................................39
3.3.2 Bluetooth host stack ........................................................................................................................39
3.4 Compiling the software ............................................................................................................................40
3.4.1 Prerequisites ......................................................................................................................................40
3.5 Deploying the software ............................................................................................................................40
3.6 Loading the Wi-Fi driver ..........................................................................................................................41
3.7 Bluetooth initialization .............................................................................................................................42
3.8 Usage examples ........................................................................................................................................43
3.8.1 5G SoftAP + 2G SoftAP ...................................................................................................................44
3.8.2 2G SoftAP + 2G Station ...................................................................................................................45
3.8.3 Country code selection ....................................................................................................................46
3.8.4 Bluetooth inquiry ...............................................................................................................................46
3.9.3 PCM loopback mode .........................................................................................................................48
4
Handling and soldering ..................................................................................................................... 52
4.3 Reflow soldering process .........................................................................................................................53
UBX-16012621 - R18
C1-Public
JODY-W1 series - System integration manual
Contents
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