Features - TYAN GC68-B7126 Service Engineer's Manual

1.3

Features

GC68(A)-B7126 (B7126G68V4E4HR)
System
Front Panel
External Drive
Bay
System Cooling
Configuration
Power Supply
Processor
Chipset
Memory
Expansion Slots
Form Factor
Chassis Model
Dimension (D x W x H)
Motherboard Name
Gross Weight
Net weight
Buttons
LEDs
I/O Ports
Q'ty / Type
HDD Backplane Support
Supported HDD Interface
FAN
Type
Input Range
Frequency
Output Watts
Efficiency
Redundancy
Serviceability
Q'ty / Socket Type
Supported CPU Series
Configurable Thermal
Design Power (cTDP)
Wattage
System Bus
#Notification
PCH
Supported DIMM Qty
DIMM Type / Speed
Capacity
Memory channel
Memory voltage
PCIe
http://www.tyan.com
1U Rackmount
GC68
26.77" x 17.26" x 1.69" (680 x 438.5 x 43mm)
S7126GM2NRE
20 kg (44 lbs)
10.5kg (23.5 lbs)
(1) ID / (1) PWR
(1) ID / (1) PWR
(1) USB 3.0 port
(4) 2.5" hot-swap 7mm NVMe SSDs /
(4) 2.5"/3.5" hot-swap SATA/SAS HDD/SSDs
NVMe / SATA 6Gb/s
(4) SATA 6Gb/s / SAS 12Gb/s / (4) uFF SATA
6Gb/s SSD / (4) uFF 2.5" NVMe U.2
(6) 4cm fans
RPSU
AC 100~240V/12~6A
50-60 Hz
850 Watts
80 plus Platinum
1+1
Hot-swap
(2) LGA4189
3rd Gen Intel Xeon Scalable Processor
Max up to 205W#
Up to 10.4/9.6 GT/s with Intel UltraPath
Interconnect (UPI) support
205W CPU is supported w/airduct @(est.)
ambient temperature 35°C
Intel C621A
(8)+(8) DIMM slots
DDR4 ECC RDIMM/RDIMM
3DS/LRDIMM/LRDIMM 3DS 3200
Up to 2,048GB RDIMM / LRDIMM DDR4
3200
8 Channels per CPU
1.2V
(2) PCIe Gen.4 x16 slots (FH/HL)
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