Package Related Soldering Information; Revision History - Philips SC16C2550 Manual

Philips Semiconductors

12.4 Package related soldering information

13. Revision history

Table 28: Revision history
Rev Date CPCN
03 20030619 -
02 20030314 -
01 20020904 -
9397 750 11621
Product data
Dual UART with 16 bytes of transmit and receive FIFOs and IrDA
Table 27: Suitability of IC packages for wave, reflow and dipping soldering methods
Mounting Package
Through-hole DBS, DIP, HDIP, SDIP, SIL suitable
mount
Surface mount BGA, LBGA, LFBGA,
SQFP, SSOP-T
TFBGA, VFBGA
DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP,
HVQFN, HVSON, SMS
[6]
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO,
VSSOP
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
[1]
(AN01026); order a copy from your Philips Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods .
[3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
[4] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
[5] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[6] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[7] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[8] Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Description
Product data (9397 750 11621). ECN 853-2368 30033 of 16 June 2003.
Modifications:
•
Figure 5 "Crystal oscillator connection." on page
added connection with resistor.
Product data (9397 750 11204). ECN 853-2368 29624 of 07 March 2003.
Product data (9397 750 08831). ECN 853-2368 28865 of 04 September 2002.
Rev. 03 — 19 June 2003
[1]
Soldering method
Wave
not suitable
[4]
,
not suitable
, SO, SOJ suitable
not recommended
not recommended
13: changed capacitors' values and
SC16C2550
encoder/decoder
[2]
Reflow
−
[3]
suitable
[5]
suitable
suitable
[6][7]
suitable
[8]
suitable
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Dipping
suitable
−
−
−
−
−
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