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Philips Semiconductors
11. Package outline
DIP40: plastic dual in-line package; 40 leads (600 mil)
L
Z
40
pin 1 index
1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
1
UNIT
max.
min.
mm
4.7
0.51
inches
0.19
0.02
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
SOT129-1
Fig 17. DIP40 package outline (SOT129-1).
9397 750 11621
Product data
Dual UART with 16 bytes of transmit and receive FIFOs and IrDA
D
e
A
2
b
b
c
1
max.
1.70
0.53
0.36
4
1.14
0.38
0.23
0.067
0.021
0.014
0.16
0.045
0.015
0.009
REFERENCES
IEC
JEDEC
051G08
MO-015
Rev. 03 — 19 June 2003
A
2
A
1
w
M
b
1
b
21
E
20
0
5
10 mm
scale
(1)
(1)
D
E
e
52.5
14.1
2.54
15.24
51.5
13.7
2.067
0.56
0.1
0.6
2.028
0.54
JEITA
SC-511-40
SC16C2550
encoder/decoder
M
E
A
c
(e )
1
M
H
e
L
M
M
1
E
H
3.60
15.80
17.42
3.05
15.24
15.90
0.14
0.62
0.69
0.12
0.60
0.63
EUROPEAN
PROJECTION
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
SOT129-1
(1)
Z
w
max.
0.254
2.25
0.01
0.089
ISSUE DATE
99-12-27
03-02-13
39 of 46
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