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printed circuit boards used for this equipment in considering the globally environmental
conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is
the alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the
lead free solder is higher approx.30 degrees C (86°F) more than that of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of "PbF" is printed either foil side or components side on the PCB
using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
- The lead free solder has to be used when repairing the equipment
for which the lead free solder is used.
(Definition: The letter of "PbF" is printed on the PCB using the
lead free solder.)
- To put lead free solder, it should be well molten and mixed with the
original lead free solder.
- Remove the remaining lead free solder on the PCB cleanly for
soldering of the new IC.
- Since the melting point of the lead free solder is higher than that of
the normal lead solder, it takes the longer time to melt the lead
free solder.
- Use the soldering iron (more than 70W) equipped with the
temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
- The following 3 types of lead free solder are available through the
service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge)
0.1 to 0.3%
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