Thermal Analysis; Thermally Significant Components - Motorola MVME5100 Manual

Thermal Analysis

C
Ambient temperature, air flow, board electrical operation and software operation affect board
component temperatures. To evaluate the thermal performance of a circuit board assembly, you
should test the board under actual operating conditions. These operating conditions vary
depending on system design.
Embedded Communications Computing performs thermal analysis in a representative system
to verify operation within specified ranges. Refer to
You should evaluate the thermal performance of the board in your application.
This appendix gives systems integrators the information necessary to conduct thermal
evaluations of the board in their specific system configuration. It identifies thermally significant
components and lists the corresponding maximum allowable component operating
temperatures. It also provides example procedures for component-level temperature
measurements.

Thermally Significant Components

Table C-1
monitor these components to assess thermal performance.
component reference designator and the maximum allowable operating temperature.
You can find components on the board by their reference designators. Refer to
Figure C-2.
The preferred temperature measurement location for a component may be:
summarizes components that show significant temperature rises. You should
junction - refers to the temperature measured by an on-chip thermal device
case - refers to the temperature at the top, center surface of the component
Table A-1 in Appendix A,
Table C-1
MVME5100 Installation and Use (V5100A/IH5)
C
Specifications.
also supplies the
Figure C-1 and
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