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Dear customer
st
LAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1
day of October,
2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in which
LAPIS established a new company, LAPIS Technology Co., Ltd. ("LAPIS
Technology") and LAPIS Technology succeeded LAPIS Semiconductor's LSI business.
Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor"
and/or "LAPIS" in this document shall be replaced with "LAPIS Technology Co., Ltd."
Furthermore, there are no changes to the documents relating to our products other than
the company name, the company trademark, logo, etc.
Thank you for your understanding.
LAPIS Technology Co., Ltd.
October 1, 2020

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Summary of Contents for Rohm LAPIS MK71050-03

  • Page 1 Dear customer LAPIS Semiconductor Co., Ltd. ("LAPIS Semiconductor"), on the 1 day of October, 2020, implemented the incorporation-type company split (shinsetsu-bunkatsu) in which LAPIS established a new company, LAPIS Technology Co., Ltd. (“LAPIS Technology”) and LAPIS Technology succeeded LAPIS Semiconductor’s LSI business. Therefore, all references to "LAPIS Semiconductor Co., Ltd.", "LAPIS Semiconductor"...
  • Page 2 PEXK71050-03_EvalKit_HardManual-02 MK71050-03 Evaluation Kit Hardware Manual Issue Date: Mar , 10, 2015...
  • Page 3: Notes

    MK71050-03 Evaluation Kit Hardware Manual Notes Precautions for the Specification 1) Contents of the Specification are the information at the time of their issuance. The information contained herein is subject to change without notice. 2) LAPIS Semiconductor has used reasonable care in preparing the information included in the Specification, but LAPIS Semiconductor does not warrant that such information is error free.
  • Page 4 MK71050-03 Evaluation Kit Hardware Manual 9) Although LAPIS Semiconductor is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, if product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 10) Failure induced under deviant condition from what defined in the Specification can not be guaranteed.
  • Page 5 1) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. LAPIS Semiconductor shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.
  • Page 6: Preface

    MK71050-03 Evaluation Kit Hardware Manual Preface This hardware manual describes hardware overview of the MK71050-03 Evaluation Kit which enables Bluetooth® LE compliant 2.4GHz band radio communication capability to Windows® PC via USB. The following related manual is available and should be referenced as needed: MK71050-03 Data Sheet ML7105 Data Sheet ML7105 User’s Manual...
  • Page 7: Table Of Contents

    MK71050-03 Evaluation Kit Hardware Manual Table of Contents Notes ....................................i Preface...................................iv Table of Contents ................................v 1. MK71050-03 Evaluation Kit overview ........................1 2. General Description..............................2 System structure..............................2 Composition of MK71050-03 USB dongle......................3 3. Operation procedure ..............................4 First setup ................................4 4.
  • Page 8: Mk71050-03 Evaluation Kit Overview

    Once the MK71050-03 Evaluation Kit delivered, please confirm that the following composition article contents are all packed in this kit. If you find any damage, leakage of the package article in the kit, please contact to your distributor or the ROHM’s responsible sales. The composition article contents...
  • Page 9: General Description

    MK71050-03 Evaluation Kit Hardware Manual 2. General Description 2. General Description 2.1 System structure MK71050-03 USB dongle can be master role of Bluetooth LE connection or slave role of Bluetooth LE connection. Figure 2-1 System overview using MK71050-03 Evaluation Kit PEXK71050-03_EvalKit_HardManual-01...
  • Page 10: Composition Of Mk71050-03 Usb Dongle

    MK71050-03 Evaluation Kit Hardware Manual 2. General Description 2.2 Composition of MK71050-03 USB dongle Figure 2-2 shows a external view of MK71050-03 USB dongle, and Table 2-1 explains the compositions. Bottom ① ③ ④ ⑤ ② ⑥ ⑦ ⑧ ⑨ Figure 2-2 External view of MK71050-03 USB dongle Table 2-1 Composition of MK71050-03 USB dongle Number...
  • Page 11: Operation Procedure

    MK71050-03 Evaluation Kit Hardware Manual 3. Operation procedure 3. Operation procedure 3.1 First setup Install driver software for USB serial IC. Virtual Com Port driver can be downloaded from following link. ① http://www.ftdichip.com/Drivers/VCP.htm ② Insert USB dongle into USB connector on your PC. ③...
  • Page 12: User Interface

    MK71050-03 Evaluation Kit Hardware Manual 4. User Interface 4. User Interface 4.1 Connecting uEASE uEASE is In Circuit Emulator (ICE) module for U8 microcontroller ML610Q482 mounted on MK71050-03 wireless module. Connection between MK71050-03 wireless module and uEASE module will be done as shown below picture. As pin pitches between uEASE connector and cable for uEASE are different, uEASE pitch conversion board has to be used.
  • Page 13: Pcb Schematics

    MK71050-03 Evaluation Kit Hardware Manual 4. User Interface 5. PCB Schematics 5.1 MK71050-03 wireless module Please refer to the next page. PEXK71050-03_EvalKit_HardManual-01...
  • Page 14 MK71050-03 Evaluation Kit Hardware Manual 4. User Interface Figure 5-1 MK71050-03 wireless module PEXK71050-03_EvalKit_HardManual-01...
  • Page 15: Usb Conversion Board

    MK71050-03 Evaluation Kit Hardware Manual 4. User Interface 5.2 USB conversion board Figure 5-2 USB conversion board PEXK71050-03_EvalKit_HardManual-01...
  • Page 16: Revision History

    MK71050-03 Evaluation Kit Hardware Manual Revision History Revision History Page Document No. Issue Date Description Previous Edition Edition PEXK71050-03_Eval 2014.Sep.16 – – Draft 1st release Kit_HardManual-01 PEXK71050-03_Eval 2015.3.10 release Kit_HardManual-02 PEXK71050-03_EvalKit_HardManual-01...

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