Sony TA-ZH1ES Service Manual page 39

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• DIGITAL, DSP and USB MICRO boards are multi-layer
printed board. However, the patterns of intermediate lay-
ers have not been included in diagrams.
• Indication of transistor.
C
Q These are omitted.
B E
• Lead layouts
Lead layout of conventional IC CSP (Chip Size Package)
Note: Among mounted electrical parts on each boards, only
parts that are described in the electrical parts list can be
replaced for repair.
The parts that are not described in the electrical parts
list cannot be replaced with single for repairing.
TA-ZH1ES
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : Internal component.
f
• 2 : Nonfl ammable resistor.
• C : Panel designation.
Note: The components identifi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specifi ed.
Note: Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spécifi é.
• A : B+ Line.
• B : B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : WALKMAN (USB)
( ) : OPT IN/COAX IN
[ ] : LINE IN
: Impossible to measure
*
• Voltages are taken with VOM (Input impedance 10 M).
surface
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
: AUDIO (ANALOG)
F
J : AUDIO (DIGITAL)
f : LINE IN
: OPT IN
h
L : COAX IN
E : USB
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
Note: Among mounted electrical parts on each boards, only
parts that are described in the electrical parts list can be
replaced for repair.
The parts that are not described in the electrical parts
list cannot be replaced with single for repairing.
• Circuit Boards Location
DISPLAY board
7818 REG board
7918 REG board
3.5 JACK board
XLR CONNECTOR board
6.3 JACK board
4.4 JACK board
39 39
DIGITAL board
LINE IN board
LPF board
POWER SUPPLY board
DSP board
317 REG board
VOL board
USB MICRO board
TA-ZH1ES
LINE OUT board
USB A board