Overheat Alarm Level; Surface Finish Of Metal Surface; Thermal Compound - YASKAWA GA500 Series Installation Manual

Figure 5.2 Heatsink Plate Temperature Output on MFAO
Note:
• The accuracy is ±5 °C (41 °F) for heatsink plate temperatures between 50 °C to 100 °C (122 °F to 212 °F).
• The installation environment has an effect on the temperature.
■

Overheat Alarm Level

If the heatsink temperature is more than the temperature set in L8-02 [Overheat Alarm Level],
the drive detects oH [Heatsink Overheat]. To enable this function, set one of H2-0x [MFDO
Function Select] to 20 [Drive Overheat Pre-Alarm (oH)].
Use L8-03 [Overheat Alarm Level] to set the operation when the drive detects oH [Heatsink
Overheat].
Refer to the drive Technical Manual for more information.
◆

Surface Finish of Metal Surface

Make sure that the metal surface to which you will install the drive meets these specifications:
• Flatness: ≤ 0.2 mm (0.0078 in)
• Roughness: ≤ 25 S
Note:
A roughness of 25 S means that the average roughness "Ra" is 6.3 a and the maximum peak "Rz" is 25 μm.
◆

Thermal Compound

The thermal compound bonds the heating and cooling elements to each other and increases
thermal transfer.
Apply the thermal compound between the heatsink plate and the mating surface. The applicable
thermal compound is different for different external heatsinks. When you select and apply a
thermal compound, contact the thermal compound manufacturer for additional information.
Table 5.4 shows an example of thermal compound selection.
Manufacturer
Shin-Etsu Chemical Co., Ltd.
*1 The thickness can change with the condition of the metal surface.
YASKAWA TOEP C710617 0SA YASKAWA AC Drive GA500 Installation Manual
Table 5.4 Example of Thermal Compound Selection
Type
Oil-based compound
Application Amount
Model
X-23-7795 100 μm - 250 μm
5 Conditions
(Thickness)
*1
11