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The BOOSTXL-TPS652170 is a BoosterPack evaluation module (EVM) for programming samples of the
TPS652170 power management IC (PMIC) with user-defined values for output voltage, sequence timing,
and other critical parameters. Modifying these parameters using the BOOSTXL-TPS652170 allows for
rapid prototyping and quick time to market when using the TPS652170 PMIC to provide power to a variety
of processors and FPGAs.
This document provides a description of how to setup the EVM and re-program the EEPROM memory of
the TPS652170 devices using the BOOSTXL-TPS652170 BoosterPack, an MSP430F5529 LaunchPad,
and the IPG-UI software. The steps in this document describe the procedure for programming samples of
the TPS652170 installed in the socket of the BOOSTXL-TPS652170 printed circuit board (PCB).
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EVM Operation
Appendix A
Software Instructions
Appendix B
EVM Documentation
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BOOSTXL-TPS652170 Printed Circuit Board (Top View)
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TPS652170 Re-Programming Example Block Diagram
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Modifying DCDC2-3, LDOx, and LSx Register Values
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Modifying Sequence (SEQ3-4, SEQ6) Registers
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Manually Writing EE_PROG_BIT to Re-Program EEPROM
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Automatically Writing EE_PROG_BIT to Re-Program EEPROM
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Registers After Successful Re-Programming (1 of 2)
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Registers After Successful Re-Programming (2 of 2)
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Component Placement-Top Assembly
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Component Placement-Bottom Assembly
SLVUBH6 - November 2018
Submit Documentation Feedback
BOOSTXL-TPS652170 EVM User's Guide
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Copyright © 2018, Texas Instruments Incorporated
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BOOSTXL-TPS652170 EVM User's Guide
User's Guide
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Table of Contents
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Summary of Contents for Texas Instruments BOOSTXL-TPS652170

  • Page 1: Table Of Contents

    SLVUBH6 – November 2018 BOOSTXL-TPS652170 EVM User's Guide The BOOSTXL-TPS652170 is a BoosterPack evaluation module (EVM) for programming samples of the TPS652170 power management IC (PMIC) with user-defined values for output voltage, sequence timing, and other critical parameters. Modifying these parameters using the BOOSTXL-TPS652170 allows for rapid prototyping and quick time to market when using the TPS652170 PMIC to provide power to a variety of processors and FPGAs.
  • Page 2 EEPROM match the power-up and power-down sequence requirements of the targeted processor that will be powered by the PMIC in the final application. The BOOSTXL-TPS652170 BoosterPack EVM is simple to test, requiring only an MSP430F5529 LaunchPad and USB A-to-micro B cable. With no load or a...
  • Page 3 3. A BOOSTXL-TPS652170 BoosterPack plug-in module 4. TPS652170 devices (TPS652170RSL) 5. An internet connection Specific instructions on how to program the TPS652170 using the BOOSTXL-TPS652170 with the IPG-UI software are provided in Appendix A, while the EVM documentation related to the design of the...
  • Page 4: Introduction

    Getting Started Figure 3 shows the high-level block diagram of the BOOSTXL-TPS652170 as it is wired to the MSP430F5529 LaunchPad through the two 20-pin headers connecting the two PCBs. It also shows the LaunchPad connected to a computer through a USB cable, which is required for programming the TPS652170 device.
  • Page 5: Boostxl-Tps652170 Boosterpack And Msp430F5529 Launchpad Block Diagram

    Figure 3. BOOSTXL-TPS652170 BoosterPack and MSP430F5529 LaunchPad Block Diagram Connecting Headers This section describes the headers on the BOOSTXL-TPS652170 used to connect the BoosterPack EVM to the MSP430F5529 LaunchPad. There are two sets of headers numbered J1-J4, each set having two rows of 10 pins, for a total of 40 pins.
  • Page 6: Electrical Connections Of Headers

    Getting Started www.ti.com Table 1 lists all of the electrical connections made when the headers of the BOOSTXL-TPS652170 and MSP430F5529 LaunchPad are connected correctly. Table 1. Electrical Connections of Headers BOOSTXL-TPS652170 Connecting Headers MSP430F5529 LaunchPad Device Pin Net Name Pin Number...
  • Page 7: Boostxl-Tps652170 Jumper List

    Software The software to be used with the BOOSTXL-TPS652170 EVM is the IPG-UI. Download the following files to ensure that all of the required software is available on the computer used for testing: 1. The latest revision of the IPG-UI EVM GUI.
  • Page 8: Boostxl-Tps652170 With Socket Open

    EVM Operation www.ti.com Figure 4. BOOSTXL-TPS652170 with Socket Open In order for the configurable load switches/LDO regulators (LS1/LDO3, LS2/LDO4) to receive power from the correct source, shunts must be installed in the correct position on both 3-pin headers (J5 and J6) as...
  • Page 9: Run The Ipg-Ui Software

    The following instructions explain how to run, setup, and operate the IPG-UI software on a computer and connect it to the BOOSTXL-TPS652170. • Run the IPG-UI software by using the Windows Start Menu and navigating to the Texas Instruments folder, or by double-clicking the desktop icon, as shown in Figure Figure 5.
  • Page 10: Creating New Ipg-Ui Project For The Tps652170

    The TPS652170 Introduction tab is now displayed, as shown in Figure 8. Click the Get Started button or the Register Map tab to begin communicating with TPS652170 device. Software Instructions SLVUBH6 – November 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 11: Tps652170 Project Introduction Tab In Ipg-Ui

    Verify that no red notifications appear in the upper left corner of the IPG-UI window. Blue notifications are informational only and do not indicate an error has occurred. Figure SLVUBH6 – November 2018 Software Instructions Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 12: Successful Write Access To Tps652170 Notification

    MSP430F5529 LaunchPad or the computer. In case of either issue, the test setup of the EVM must be debugged before continuing. Software Instructions SLVUBH6 – November 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 13: Failed Gui Communication To Tps652170 Notification

    Write the new value of this register by clicking the button labeled W in this row of the register map table, as shown in Figure SLVUBH6 – November 2018 Software Instructions Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 14: Disable Go Bit In Slew Register

    Figure 14. Modifying DEFDCDC1 Register Value • Verify the new voltage setting by measuring the DCDC1 test point (TP14) on the BOOSTXL- Software Instructions SLVUBH6 – November 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 15 TPS652170 device is power-cycled. • Figure 15 Figure 16 show all of the available EEPROM-backed registers of the TPS652170 that may be programmed. SLVUBH6 – November 2018 Software Instructions Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 16: Eeprom-Backed Registers Of The Tps652170 (1 Of 2)

    Re-Programming the EEPROM of the TPS652170 Device www.ti.com Figure 15. EEPROM-Backed Registers of the TPS652170 (1 of 2) Software Instructions SLVUBH6 – November 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 17: Eeprom-Backed Registers Of The Tps652170 (2 Of 2)

    Figure 16. EEPROM-Backed Registers of the TPS652170 (2 of 2) • For this example, the TPS652170 will be re-programmed from its original settings to provide power to the processor shown in Figure SLVUBH6 – November 2018 Software Instructions Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 18 DRAM Memory Module VDD, VDDQ, VDDCA, VDD1, VDD2 VREF Copyright © 2018, Texas Instruments Incorporated (1) The power-on sequence order is listed for each rail, numbered 1-4. Figure 17. TPS652170 Re-Programming Example Block Diagram • The voltage setpoint of DCDC1 has already been modified, so only the remaining DC/DC converters and LDO1 regulator voltages need to be modified at this time.
  • Page 19 (0x19, 0x1A, and 0x1B), as shown in Figure 19. The SEQ4 register (0x1C) controls the sequence order of LS2/LDO4 but this register does not need to be changed for this example. SLVUBH6 – November 2018 Software Instructions Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 20 EEPROM memory of the TPS652170 device. When the programming mode is entered manually, the EE_PROG_BIT must be reset to 0b to exit programming mode. Software Instructions SLVUBH6 – November 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 21 Figure 21. Automatically Writing EE_PROG_BIT to Re-Program EEPROM • Now the BOOSTXL-TPS652170 board can be reset by moving SW1 (labeled PWR) to the OFF position and then moving it back to the ON position. Click Read All on the IPG-UI to verify that all of the registers programmed into the EEPROM has been re-programmed correctly.
  • Page 22 Re-Programming the EEPROM of the TPS652170 Device www.ti.com Figure 22. Registers After Successful Re-Programming (1 of 2) Software Instructions SLVUBH6 – November 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 23 NOTE: If the voltage on the PWR_EN pin of the TPS652170 is less than to 7 V, this is too low for re-programming the EEPROM. SLVUBH6 – November 2018 Software Instructions Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 24 EEPROM. None of the EEPROM-backed bits (highlighted in red) that were changed in the example re-programming have been highlighted in blue. The successful re-programming of the EEPROM can also be verified on the BOOSTXL-TPS652170 hardware by measuring the output voltages of DCDC1, DCDC2, DCDC3, LDO1, LDO2, LS1 (LDO3) and LS2 with a multi-meter and by measuring the power-on sequence timing with an oscilloscope.
  • Page 25 SLVUBH6 – November 2018 EVM Documentation Layout Figure 24 through Figure 31 show the board layout for the BOOSTXL-TPS652170 Figure 24. Component Placement—Top Assembly Figure 25. Component Placement—Bottom Assembly SLVUBH6 – November 2018 EVM Documentation Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 26: Layout-Top Composite

    Layout www.ti.com Figure 26. Layout—Top Composite Figure 27. Layout—Bottom Composite EVM Documentation SLVUBH6 – November 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 27: Top Layer

    Layout www.ti.com Figure 28. Top Layer Figure 29. Inner Layer 1 (GND Plane) SLVUBH6 – November 2018 EVM Documentation Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 28: Inner Layer 2 (Signal)

    Layout www.ti.com Figure 30. Inner Layer 2 (Signal) Figure 31. Bottom Layer (Top View) EVM Documentation SLVUBH6 – November 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 29: Boostxl-Tps652170 Schematic

    Schematic www.ti.com Schematic Figure 32 shows the schematic for BOOSTXL-TPS652170. USBLP USBSW 3V3LP 3V3SW VOUT VOUT 0.1uF 10uF 150uF 10uF 0.1uF TPS22915CYFPR 10uH TPS22915CYFPR USBSW 3V3LP 0.1uF PWR_EN 4.7uF 1.5k 0.1uF 165k 0.01uF 3V3SW 4.7uF 10uF 11.0k 3V3SW 10uF 10uF...
  • Page 30: Bill Of Materials

    Bill of Materials www.ti.com Bill of Materials Table 4 provides the bill of materials (BOM) for the BOOSTXL-TPS652170. Table 4. Bill of Materials Designator Quantity Value Description PackageRefere PartNumber Manufacturer C1, C7 1 uF CAP, CERM, 1 0402 C1005X5R1E10 uF, 25 V, +/-...
  • Page 31 0.063 W, AEC- JNED Q200 Grade 0, 0402 20.0 k RES, 20.0 k, 1%, 0402 CRCW040220K0 Vishay-Dale 0.063 W, AEC- FKED Q200 Grade 0, 0402 SLVUBH6 – November 2018 EVM Documentation Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 32 Enplas Tech 0.4 mm Pitch 0.4 mm Pitch 0.4-01 Solutions FID1, FID2, Fiducial mark. FID3, FID4, There is nothing FID5, FID6 to buy or mount. EVM Documentation SLVUBH6 – November 2018 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated...
  • Page 33 STANDARD TERMS FOR EVALUATION MODULES Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein.
  • Page 34 FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
  • Page 35 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿6丁目24番1号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes.
  • Page 36 Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2018, Texas Instruments Incorporated...
  • Page 37 TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2018, Texas Instruments Incorporated...

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