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3
Hardware
3.1
Dimensions
T / p sensor
Fig. 1
Dimensions in mm (inch)
Fig. 2 Recommended PCB footprint
3.2
Mounting Recommendation
The EE895 is not intended for reflow soldering and consequently it does not feature a moisture
sensitivity level rate (MSL). Nevertheless, for storage and handling it shall be regarded as compatible
with MSL 1.
EE895 may only be soldered manually. A max. temperature of 360°C may be applied for max. 10 s
per solder point.
ESD precautions shall be observed while manually soldering the EE895.
The EE895 can be mounted facing either upwards or downwards.
3.2.1
Mounting via Solder Pads
The EE895 module can be mounted onto a pluggable female header or directly onto the electronics
board by using a pin-header with 2.54 mm (0.1 inch) pitch.
The minimum clearance of 2 mm (0.08 inch) shall be strictly observed. This is necessary for free air
flow around the CO
6
Hallo Text
Side view
Air inlet through dust filter
towards CO
sensing cell
2
19.5
(0.8)
27.2
(1.1)
CO
sensing cell
2
sensing cell and around the T/p sensor.
2
male pins
female header
Air inlet through dust filter
towards CO sensing cell
male pins
Fig. 3 Mounting with soldered pin header
1.50
(0.06")
Plated half-holes
Through-holes
Pluggable
T/p sensor
Soldered single pin header
T/p sensor
User Manual EE895 Miniature Sensor Module for CO
Bottom view
35.0
(1.4)
T / p sensor
h>2 mm (0.08")
h>2 mm (0.08")
, T and p
2
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